Wafer Defect Measuring Device Using Air Blowers
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Solution Overview
Problem
Existing wafer defect measurement devices often cause contamination and measurement errors due to contact with the side and lower surfaces of the wafer during inspection.
Innovation Solution
A device with upper and lower blowers that float and fix the wafer using air injection, combined with contamination measuring parts for the upper, lower, and side surfaces, minimizing contact and enabling simultaneous defect measurement across all surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a side surface or a lower surface of the wafer is supported by contact during inspection, then the wafer can be held stable for measurement, but contamination occurs at the side surface or the lower surface of the wafer
Solution Approach 1:
The patent uses air blowers to support the wafer from below through air pressure, creating a non-contact support system. The side surfaces are also protected by air curtains generated by side blowers, allowing the wafer to be held stable during inspection without physical contact that would cause contamination.
Solution Approach 2:
Air acts as an intermediary medium between the support system and the wafer. Instead of direct mechanical contact, air pressure and air curtains serve as the mediating force to hold and protect the wafer, preventing contamination while maintaining measurement stability.
2Ease of operation
If traditional contact-based support methods are used, then the wafer can be positioned for inspection, but measurement errors are generated due to contamination
Solution Approach 1:
Air blowers provide non-contact positioning and support for the wafer, eliminating contamination from mechanical contact. The air pressure system positions the wafer accurately while the air curtains protect the surfaces, ensuring both ease of operation and measurement precision.
3Productivity
If the wafer is inspected using contact-based support, then defects can be detected, but additional defects may be generated during the inspection process
Solution Approach 1:
The air blower system enables continuous, non-contact inspection by supporting the wafer without physical contact. Air curtains protect the wafer surfaces during the inspection process, allowing high productivity while preventing the generation of additional defects through contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents contamination and reduces defect rates by allowing non-contact measurement of wafer defects, enhancing inspection reliability and productivity.
Implementation Method 1
a lower blower configured to inject air to a lower surface of a wafer to float the wafer
Implementation Method 2
an upper blower provided to be moved up and down with respect to the lower blower and configured to inject the air to an upper surface of the wafer to fix the wafer
Data Source
AI summary
Provided is a device for measuring wafer defects, which prevents damage of a wafer and also measures defects at upper, lower and side surfaces of the wafer simultaneously.The device for measuring wafer defects includes a lower blower configured to inject air to a lower surface of a wafer to float the wafer; an upper blower provided to be moved up and down with respect to the lower blower and configured to inject the air to an upper surface of the wafer to fix the wafer; an upper contamination measuring part provided at an upper side of the upper blower and configured to detect contamination on the upper surface of the wafer; a lower contamination measuring part provided at a lower side of the lower blower and configured to detect contamination on the lower surface of the wafer; and a side contamination measuring part provided between the upper and lower blowers and configured to detect contamination on a side surface of the wafer.