Wafer Delivery Height Sensing for Collision-Free Substrate Transfer
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Solution Overview
Problem
Existing semiconductor manufacturing systems face challenges in accurately delivering substrates while preventing collisions, which can damage delicate and costly materials, and there is a need for improved methods to handle wafer warpage during the delivery process.
Innovation Solution
A robotic delivery system with sensors, such as laser telemeters or image cameras, detects the 3D profile of wafers to prevent collisions by adjusting the delivery path and position, ensuring precise alignment and handling of warped wafers through real-time adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If automated robotic equipment is used to transfer wafers, then productivity and manufacturing efficiency are improved, but the risk of collisions and damage to delicate substrates increases
Solution Approach 1:
The system performs preliminary actions by detecting wafer parameters (such as warpage, thickness, or position) before the transfer operation, and pre-adjusts robotic arm parameters (such as speed, position, or trajectory) to prevent collisions during the transfer process
Solution Approach 2:
The system uses sensors to detect wafer parameters in real-time during the transfer process, and the controller adjusts robotic arm parameters based on this feedback to dynamically prevent collisions while maintaining high-speed operation
2Device complexity
If traditional transfer methods are used without real-time detection, then device complexity is reduced, but manufacturing precision and collision detection capability deteriorate
Solution Approach 1:
The system replaces complex mechanical adjustment mechanisms with a sensor-based detection and controller-based parameter adjustment system, achieving high precision through electronic control rather than mechanical complexity
Solution Approach 2:
The system achieves high manufacturing precision by dynamically changing operational parameters (such as robotic arm speed, position, or trajectory) based on detected wafer parameters, rather than relying on complex mechanical structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces the risk of collisions and enhances manufacturing efficiency by ensuring accurate substrate placement, improving product quality and reducing material losses.
Implementation Method 1
detecting, by a sensor, a height of the substrate relative to the mount while the movement of the substrate
Data Source
AI summary
A method of a wafer substrate in semiconductor manufacturing is provided. The method includes moving, by a delivery assembly, the substrate toward a mount. The delivery assembly comprising a blade, and the substrate is positioned on the blade. The method also includes detecting, by a sensor, a height of the substrate relative to the mount while the movement of the substrate. When the height of the substrate is less than a first lower threshold, the method includes terminating the movement of the substrate. When the height of the substrate is greater than the first threshold but less than a first preset value, the method includes keep moving the substrate and performing a first adjustment to adjust the position of the blade according to the height of the substrate.