Wafer Surface Detection Array for Faster Optical Scanning
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Solution Overview
Problem
Conventional optical detection methods for semiconductor wafers are limited by slow detection speeds, which compromise detection efficiency and quality.
Innovation Solution
A detection device with a detection assembly comprising multiple rows of detection units, each including an optical path assembly and detection component, arranged in a matrix configuration, and a driving assembly to move the object or assembly in multiple directions, allowing simultaneous scanning of non-overlapping areas for enhanced coverage and imaging quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a single detection unit is used to detect the wafer surface, then the device complexity is low, but the detection speed is slow
Solution Approach 1:
The detection device divides the detection task into multiple parallel detection units arranged in rows and columns. Each detection unit independently detects a specific region of the wafer surface, enabling simultaneous multi-region detection. This segmentation of the detection system directly increases detection speed without requiring complex coordination between components.
Solution Approach 2:
Multiple detection units are combined into a unified detection system with coordinated control. The detection units work together as an integrated system, where each unit contributes to the overall detection of the wafer surface. This merging approach maintains relatively simple individual unit designs while achieving high-speed detection through parallel operation.
2Productivity
If multiple detection units are used to scan different areas simultaneously, then the detection efficiency is improved, but the device complexity increases
Solution Approach 1:
The detection system is segmented into multiple independent detection units that can simultaneously scan different areas of the wafer. Each detection unit operates autonomously to detect its assigned region, enabling parallel detection that significantly improves detection efficiency while keeping individual unit complexity low.
Solution Approach 2:
The detection units are arranged in a two-dimensional matrix pattern (rows and columns) on the wafer surface. This spatial arrangement in multiple dimensions allows comprehensive coverage of the wafer surface through parallel detection, improving productivity without requiring complex temporal coordination or sequential scanning mechanisms.
3Area of stationary object
If the detection units are arranged in a matrix configuration with non-overlapping scanning ranges, then the detection coverage is enhanced, but the device complexity increases
Solution Approach 1:
The wafer surface is divided into multiple non-overlapping detection regions, with each region assigned to a specific detection unit. This segmentation ensures complete coverage of the wafer surface without redundant detection areas, maximizing detection coverage while maintaining simple, well-defined detection zones for each unit.
Solution Approach 2:
Detection units are arranged in a matrix configuration spanning two dimensions on the wafer surface. This two-dimensional arrangement allows systematic coverage of the entire wafer area through coordinated positioning of multiple units, enhancing detection coverage while using straightforward geometric relationships rather than complex detection patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves detection efficiency and quality by enabling simultaneous scanning of multiple areas using multiple detection units, reducing detection time while maintaining high imaging resolution.
Implementation Method 1
Light reflected by the wafer is transmitted to some components such as a camera through the objective lens
Implementation Method 2
The objective lens is configured to collect the signal light returned by the surface of the to-be-detected object, and transmit the signal light to the beam splitter
Implementation Method 3
The beam splitter is configured to transmit light emitted from the light source to the objective lens. The objective lens is configured to collect the signal light returned by the surface of the to-be-detected object, and transmit the signal light to the beam splitter. The beam splitter is further configured to reflect the signal light collected by the objective lens to the detection component
Implementation Method 4
The detection component is configured to detect the detection area based on the signal light
Data Source
AI summary
A detection device, a detection apparatus, and a detection method are provided. The detection device includes a detection assembly and a driving assembly. At least two rows of detection units are provided, and the detection units are arranged in a matrix along the first direction and the second direction. During detection, the driving assembly may drive one or both of the to-be-detected object and the detection assembly to move along at least one of the first direction and the second direction, so that the detection units scan different areas of the surface of the to-be-detected object, thereby realizing a scanning of the entire surface. That is, the scanning of the surface of the to-be-detected object is completed by using multiple detection units, which improves detection efficiency for the to-be-detected surface, and realizes a relatively high imaging quality.