Wafer Developer Nozzle Scan Control for Uniform Film
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Solution Overview
Problem
Existing development processing methods face challenges in achieving uniformity of developer application on a substrate, leading to variations in processing progress depending on the position on the wafer due to differences in application timing and centrifugal forces.
Innovation Solution
A development processing apparatus with a rotary holding unit and a controller that executes scan-in and scan-out controls, where the nozzle moves from the outer circumference to the center and vice versa, while gradually reducing the rotation speed of the wafer, ensuring consistent developer application and spreading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the nozzle moves from the outer circumference to the center while the wafer rotates, then the developer can be applied to the wafer surface, but the rotation speed variations cause non-uniform application across different positions
Solution Approach 1:
The system dynamically adjusts the rotation speed of the wafer during the development process. The rotation speed is controlled to vary based on the radial position of the nozzle, ensuring that the linear speed of the wafer surface remains consistent regardless of the nozzle's position. This dynamic speed adjustment compensates for the changing centrifugal forces and maintains uniform developer application across the entire wafer surface.
Solution Approach 2:
The invention changes the rotation speed parameter of the wafer during the development process. By adjusting the rotation speed according to the nozzle's radial position, the system maintains consistent processing conditions. Specifically, the rotation speed is reduced when the nozzle is near the outer circumference and increased when near the center, keeping the effective application parameters uniform across different positions.
2Manufacturing precision
If the rotation speed is reduced during scan-out control, then the liquid film uniformity is improved, but the processing time increases
Solution Approach 1:
The system uses dynamic rotation speed adjustment to optimize both film uniformity and processing time. Rather than maintaining a constantly low speed, the system adjusts the speed in real-time based on the nozzle position and development stage, achieving uniform film formation while minimizing unnecessary time delays.
Solution Approach 2:
The development process employs periodic variations in rotation speed corresponding to the scan-in and scan-out cycles. The rotation speed is periodically adjusted to match the nozzle movement patterns, creating optimal conditions for film formation during each cycle while maintaining overall process efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a highly uniform liquid film formation, suppressing variations in development processing progress across the substrate and enhancing the smooth application of the developer by adjusting centrifugal forces.
Implementation Method 1
gradually reduces a rotation speed of the wafer as a center of the liquid contact surface approaches the outer circumference of the wafer
Data Source
AI summary
Provided is a development processing apparatus including a rotary holding unit configured to hold and rotate a wafer, a developer supply unit including a nozzle having a liquid contact surface facing a surface of the wafer and an ejection port opening to the liquid contact surface, and a controller. The controller is configured to: while the wafer rotates, execute a control of causing a developer to be ejected from the ejection port and moving the nozzle from an circumference side to a rotation center side of the wafer; after execution of the control, execute a control of moving the nozzle from the rotation center side to the outer circumference side of the wafer; and during execution of the control, execute a control of gradually reducing the rotation speed of the wafer as the center of the liquid contact surface approaches the outer circumference.