Wafer Deviation Detection Imaging System

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Solution Overview

Problem

Existing semiconductor manufacturing methods face limitations in accurately detecting the deviation of a semiconductor wafer from its mounting position due to influences from the susceptor and wafer materials, leading to inaccuracies in crystal layer formation.

Innovation Solution

An imaging device with an imaging unit and image analysis unit is employed to capture images of the semiconductor wafer and its mounting section, analyzing deviations by measuring distances between the wafer and the mounting section or susceptor and preheat ring, using a light transmissive member to block specific wavelengths and prevent overexposure, and providing a warning notification system.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If thermal radiation measurement is used to detect wafer position, then the detection method is simple, but the measurement accuracy is limited due to material influence

Engineering Contradiction:

Improvedetection method simplicityVSAvoiddeviation detection accuracy

Core Design Contradiction:

Ease of manufactureVSMeasurement precision

Solution Approach 1:

The patent replaces the thermal radiation measurement method (optical/thermal field) with an imaging-based visual detection system. The imaging unit captures images of the wafer and susceptor, and the image analysis unit processes these images to calculate deviation distances, substituting the previous thermal-based detection approach with a visual imaging approach that is not affected by material thermal properties.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Area of stationary object

If imaging unit captures image of entire reaction chamber, then complete view is obtained, but image quality deteriorates due to intense light from heat sources

Engineering Contradiction:

Improveimaging coverage areaVSAvoidimage quality

Core Design Contradiction:

Area of stationary objectVSMeasurement precision

Solution Approach 1:

The patent divides the imaging field into different wavelength segments using a light transmissive member with a wavelength selective region. This member transmits light in specific wavelength ranges while blocking others, effectively segmenting the spectral content to prevent overexposure from intense heat source radiation while maintaining visibility of the wafer and susceptor.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The light transmissive member acts as an intermediary between the intense heat source light and the imaging unit. It selectively transmits and blocks different wavelengths, mediating the light interaction to protect the imaging unit from overexposure while maintaining sufficient light transmission for clear imaging.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If light transmissive member blocks specific wavelengths, then image overexposure is prevented, but light transmission is reduced

Engineering Contradiction:

Improveimage exposure controlVSAvoidlight transmission efficiency

Core Design Contradiction:

ReliabilityVSUse of energy by moving object

Solution Approach 1:

The light transmissive member has different optical properties in different regions: a light blocking region that blocks specific wavelengths to prevent overexposure, and a light transmissive region that allows other wavelengths to pass through. This local differentiation of optical properties enables selective wavelength management, blocking harmful wavelengths while transmitting useful light for imaging.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables high-accuracy detection of wafer deviations, allowing for early maintenance notices and precise crystal layer formation, while maintaining heat resistance and preventing image overexposure from intense light sources.

Implementation Method 1

an imaging unit that images first and second objects placed in a reaction chamber

Methodology Applied

Scientific EffectLight reflection: Reflection

Implementation Method 2

The light transmissive member may block infrared rays

Methodology Applied

Scientific EffectWavelength selective absorption: Absorption (EM radiation)

Implementation Method 3

coolant supply means for supplying a coolant into the housing case

Methodology Applied

Scientific EffectConvection cooling: Convection

Data Source

PatentUS9250196B2Imaging device, semiconductor manufacturing apparatus, and semiconductor manufacturing method

Publication Date: 2016.02.02 EPICREW CORP

AI summary

There are provided a susceptor having a recessed wafer mounting section, in which a semiconductor wafer is mounted and which is configured to include a circular bottom portion and a side wall portion, on an upper surface, a reaction chamber in which the susceptor is provided, an imaging unit that is provided above the reaction chamber and images the semiconductor wafer and the wafer mounting section, and an image analysis unit that analyzes the deviation of the semiconductor wafer from the wafer mounting section on the basis of an image captured by the imaging unit.