Wafer Die Separation Using Support Tape to Maintain Dice Spacing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for expanding dicing tape to separate small integrated circuit dice provide insufficient space between dice, leading to handling difficulties and damage during the separation process.
Innovation Solution
A method involving the attachment of a dicing tape sheet to a ring frame, stretching the tape to radially expand the dice, and applying support tape to prevent inward retraction, ensuring adequate spacing between dice for safe handling and pick-up.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the dicing tape is stretched to separate small dice, then the dice are separated, but the space between dice becomes insufficient and shrinks after initial expansion
Solution Approach 1:
A support ring is attached to the dicing tape before stretching to prevent inward retraction. This preliminary structural reinforcement ensures that when the tape is stretched and then released, the dice maintain adequate spacing without collapsing back together, solving the spacing stability problem.
Solution Approach 2:
The support ring acts as an intermediary element between the dicing tape and the dice. It mediates the mechanical stress during stretching and prevents the tape from retracting inward, thereby maintaining consistent spacing between small dice throughout the handling process.
2Ease of operation
If conventional dicing tape expansion methods are used for very small dice, then the dice are separated, but handling becomes difficult and damage occurs
Solution Approach 1:
The support ring is attached in advance to provide structural reinforcement before handling operations begin. This preliminary action ensures that the dice remain properly spaced and supported throughout picking, placing, and handling operations, preventing damage while improving ease of operation.
Solution Approach 2:
The support ring provides a cushioning effect by distributing mechanical stresses and preventing the dicing tape from retracting inward. This beforehand protection creates a stable environment for handling very small dice, reducing the risk of damage during pick and place operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively maintains sufficient space between dice, allowing for safe and damage-free handling and pick-up using conventional pick and place machines.
Implementation Method 1
a dicing tape sheet 10 that is relatively elastically deformable
Implementation Method 2
attaching support tape 60 to the ring frame 40 and the dicing tape sheet 10
Data Source
AI summary
A method of singulating a wafer starts with fracturing the wafer. The method may also include attaching the dicing tape sheet to a ring frame; relatively raising a portion of the dicing tape sheet supporting the wafer with respect to the ring frame; and attaching support tape to the ring frame and the dicing tape sheet.