Wafer Dicing Blade Depth Adjustment via Optical Feedback
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Solution Overview
Problem
Existing methods for cutting wafers using a cutting blade are inefficient due to the need to detect the blade's position after cutting, which reduces efficiency as the blade wears and requires movement to other units for depth adjustment.
Innovation Solution
A method involving projected dicing lines on a wafer held by an adhesive tape, where an image is captured to determine if the cutting blade has fully severed the wafer, and the blade's position is adjusted if necessary to ensure complete severance without reducing cutting efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the cutting blade is used to cut the wafer continuously, then the cutting efficiency is improved, but the blade wears and the actual cutting depth becomes smaller than the calculated depth
Solution Approach 1:
The system uses optical sensors to detect the actual position of the cutting blade tip during the cutting process. This detection information is fed back to the control unit, which then adjusts the blade depth in real-time to compensate for wear, ensuring the actual cutting depth matches the required depth throughout the blade's service life.
Solution Approach 2:
The system dynamically changes the cutting blade depth parameter based on detected wear. The control unit calculates the wear amount by comparing the actual blade tip position with the reference position, then adjusts the depth parameter accordingly to maintain precise cutting depth despite continuous usage and blade degradation.
2Manufacturing precision
If the tip end of the cutting blade is detected by position detecting means after chips are removed, then the cutting depth can be managed accurately, but it is time-consuming and reduces cutting efficiency
Solution Approach 1:
The system performs preliminary detection of the cutting blade tip position using optical sensors before the cutting process begins. The control unit calculates the initial depth based on this detection and stores it as reference information. This preliminary action eliminates the need for time-consuming detection during or after cutting, as the blade depth can be managed based on pre-calculated values throughout the cutting process.
Solution Approach 2:
The system replaces mechanical detection methods (which require physical contact and time-consuming operations) with optical detection. The optical sensors non-contactly detect the blade tip position, and the control unit processes this information to manage cutting depth, significantly reducing the time required compared to mechanical detection methods.
3Manufacturing precision
If the cutting blade is moved to a cut mark forming unit to calculate diameter from cut mark length, then the blade wear can be measured, but it is time-consuming and reduces cutting efficiency
Solution Approach 1:
The system introduces an intermediary measurement method using optical sensors to detect the cutting blade tip position directly during the cutting process. Instead of moving the blade to a separate cut mark forming unit, the optical sensor acts as an intermediary that measures blade wear in-situ by detecting the actual tip position, eliminating the need for separate measurement operations and reducing time loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures complete severance of the wafer without reducing cutting efficiency by capturing images to assess cut marks and adjusting the blade's position accordingly, preventing incomplete cuts while maintaining efficient operation.
Implementation Method 1
position detecting means such as an optical sensor or the like
Implementation Method 2
capturing an image of an area incised by the cutting blade with image capturing means
Data Source
AI summary
Disclosed herein is a method of dividing a wafer including an exposed area incising step of lowering a cutting blade to a preset lowered position for fully severing the wafer to cause the cutting blade to incise an exposed area of a wafer unit, an image capturing step of capturing an image of the exposed area which the cutting blade has incised in the exposed area incising step, with image capturing means, a determining step of determining whether or not it is possible to fully sever the wafer on the basis of the captured image in the image capturing step, and an adjusting step of increasing a distance by which to lower the cutting blade if it is determined that it is impossible to fully sever the wafer in the determining step.