Wafer Dicing Blade Protrusion Design for Warpage Control
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Solution Overview
Problem
Current wafer dicing technologies face challenges in reducing manufacturing costs and enhancing reliability while maintaining high-performance semiconductor chips, particularly in the cutting process where the width of the cutting part affects the number of chips that can be formed on a single wafer and the warpage phenomenon during cutting.
Innovation Solution
A wafer dicing blade with a cutting part having a protrusion and a support where the protrusion extends beyond the edge of the support, made from a diamond-containing material, and a support made of a material with lower hardness than the wafer, such as nickel, to minimize contact and prevent widening of cut portions, combined with a length maintaining device for maintaining the protrusion's length.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the width of the cutting part is reduced to increase the number of chips per wafer, then productivity increases, but the cutting part becomes more susceptible to warpage and deformation
Solution Approach 1:
The cutting part is divided into two functional regions: a protrusion portion that extends beyond the support and contacts the wafer for cutting, and a supported portion that is covered by the support structure. This segmentation allows the cutting edge to be narrow for high productivity while the supported portion provides structural stability and prevents warpage during the cutting process.
2Reliability
If a harder material is used for the cutting part to maintain edge integrity, then reliability improves, but the support material becomes difficult to select and manufacturing complexity increases
Solution Approach 1:
The cutting part exhibits local quality variation: the protrusion portion is made of a hard material (such as diamond-containing material with hardness of 8000-10000 HV) to maintain edge integrity during cutting, while the supported portion is made of a softer material (such as nickel with hardness of 500-700 HV) that is easier to manufacture and allows for better support coverage. This local differentiation resolves the contradiction between reliability and manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the width of the cutting part, decreases scribe lane width, increases the number of chips per wafer, extends the cutting part's usage period, and minimizes warpage, thereby reducing manufacturing costs and improving the reliability and process margin of the wafer cutting process.
Implementation Method 1
The cutting part may include a diamond-containing material
Implementation Method 2
the protrusion of the cutting part extending beyond an edge of the support
Data Source
AI summary
A wafer dicing blade includes a cutting part including a protrusion, the protrusion having a uniform region with a substantially uniform width, and a support covering at least one sidewall of the cutting part, the protrusion of the cutting part extending beyond an edge of the support.