Wafer Dicing with Chamfer Gap Filling to Prevent Die Flying
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Solution Overview
Problem
Existing methods for manufacturing device chips face issues with die flying and increased man-hours due to the peeling of end material chips during cutting, especially when a chamfered portion is present on the workpiece, leading to potential damage and inefficiency.
Innovation Solution
A method and apparatus that involves bonding a tape larger than the workpiece diameter, filling the gap between the chamfered portion and the tape with a filling member, and cutting the workpiece along division lines while maintaining the end material chips adhered to the tape, using a cutting apparatus with a filling member supply unit and detection unit to minimize die flying.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If both surfaces of a workpiece are bound between tapes to suppress die flying from end material chips, then the end material chips are prevented from peeling off and scattering, but the process requires peeling off the tape divided into device sizes by processing, which increases man-hours
Solution Approach 1:
The patent segments the workpiece processing by introducing a filler material that creates distinct separation zones between device chips and end material chips. This allows the end material chips to remain adhered to the tape without requiring complete tape removal, as the filler provides sufficient separation and containment.
Solution Approach 2:
The filler material acts as an intermediary substance between the workpiece and the tape. It fills the gap between the chamfered portion and the tape, creating a barrier that prevents cutting water from causing die flying while allowing the end material chips to remain attached to the tape for efficient handling.
2Ease of manufacture
If a chamfered portion is formed on the outer peripheral edge of the workpiece, then the workpiece structure is improved for processing, but cutting water easily enters between the workpiece and the dicing tape during cutting, leading to die flying
Solution Approach 1:
The filler material serves as an intermediary barrier that blocks the harmful effect of cutting water from entering the gap between the chamfered workpiece edge and the tape. It maintains the beneficial chamfered structure while preventing water intrusion that would cause die flying.
Solution Approach 2:
The filler material is applied in advance to prevent the harmful effect of cutting water intrusion before it can occur during the cutting process. By pre-filling the gap, the system proactively counteracts the potential for die flying caused by water entry.
3Reliability
If the tape is made larger than the outer diameter of the workpiece to cover the entire workpiece, then the end material chips are better contained, but the gap between the chamfered portion and the tape allows cutting water to enter and cause die flying
Solution Approach 1:
The filler material is introduced as an intermediary substance that seals the gap between the chamfered workpiece portion and the tape. This prevents cutting water from entering through the gap while maintaining the larger tape size for comprehensive end material chip containment.
Solution Approach 2:
Instead of making the entire tape structure more complex, the patent applies the filler material locally at the specific gap region between the chamfered edge and the tape. This targeted approach prevents water intrusion at the critical location while maintaining the overall simplicity of the larger tape configuration.
Data Source
AI summary
A device chip manufacturing method is of dividing a workpiece that has a disc shape and in which a chamfered portion is formed along an outer peripheral edge and a plurality of division lines is set, along the division lines to dice the workpiece into device chips. The method includes: bonding a tape larger than an outer diameter of the workpiece to a front surface side or a back surface side of the workpiece; filling a gap between the chamfered portion formed on the outer peripheral edge of the workpiece and the tape, with a filling member; and after the filling, moving the workpiece and a cutting blade relative to each other to cut the workpiece along the division lines, and dividing the workpiece to be diced into the device chips.