Wafer Dicing Surfactant Composition for Particle and Residue Control
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Solution Overview
Problem
Silicon particles scattered during wafer dicing adhere to the wafer surface, reducing yield and necessitating a cleanser that prevents residue formation and enhances cleansing ability.
Innovation Solution
A cleansing composition for wafer dicing comprising a surfactant with a hydrophilic moiety, such as monosaccharides or disaccharides, and a hydrophobic moiety, including a C4 to C20 polyethylene glycol group substituted with an alkyl benzyl group, is used to prevent silicon particle adsorption and enhance cleansing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conventional cleanser is used to remove silicon particles, then the wafer surface can be cleaned, but residue is left on the wafer surface
Solution Approach 1:
The patent changes the chemical parameters of the cleanser by specifying a particular surfactant structure with hydrophilic moiety (monosaccharide or disaccharide) and hydrophobic moiety (C4-C20 polyethylene glycol group substituted with alkyl benzyl group). This parameter change in molecular structure enables effective silicon particle removal while preventing residue formation on the wafer surface.
Solution Approach 2:
The invention uses a composite surfactant molecule combining hydrophilic and hydrophobic moieties. The hydrophobic part interacts with silicon particles for removal, while the hydrophilic part ensures water solubility and prevents residue, creating a composite material that simultaneously achieves cleaning and residue-free surfaces.
2Object-affected harmful factors
If a cleanser with strong cleansing ability is used, then organic contaminants are removed effectively, but residue formation increases
Solution Approach 1:
The patent optimizes the molecular weight and structural parameters of the surfactant to achieve balanced cleansing power and low residue. The specific range of polyethylene glycol chain length (C4-C20) and the choice of monosaccharide/disaccharide hydrophilic groups are parameter changes that enable strong organic contaminant removal while maintaining low residue formation.
3Ease of manufacture
If the cleanser composition is simplified, then manufacturing cost decreases, but cleansing ability for both silicon particles and organic contaminants is reduced
Solution Approach 1:
The patent specifies precise parameter ranges for the surfactant structure (polyethylene glycol chain length C4-C20, specific hydrophilic groups) to achieve optimal cleansing performance. These parameter changes ensure that the simplified composition maintains high cleansing ability for both silicon particles and organic contaminants while being cost-effective to manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively prevents silicon particle adhesion and residue formation on the wafer surface, maintaining high yield and cleansing efficiency.
Implementation Method 1
Silicon particles, which are scattered when the wafer is cut by a blade during the wafer dicing process, are adsorbed on a top surface of the wafer or on a pad, resulting in a decrease in yield for the manufacturing process. A cleanser for wafer dicing may be used to prevent these problems.
Implementation Method 2
a surfactant that includes a hydrophilic moiety and a hydrophobic moiety, and a solvent. The hydrophilic moiety is selected from monosaccharides, disaccharides, or derivatives thereof, and the hydrophobic moiety includes a C4 to C20 polyethylene glycol group, which is substituted with an alkyl benzyl group.
Data Source
AI summary
A cleansing composition for wafer dicing includes a surfactant that contains a hydrophilic moiety and a hydrophobic moiety, and a solvent. The hydrophilic moiety is selected from monosaccharides, disaccharides, or derivatives thereof. The hydrophobic moiety includes a C4 to C20 polyethylene glycol group substituted with an alkyl benzyl group.