Wafer Dicing Fluid Ejector for Corrosion Prevention
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Solution Overview
Problem
The wet cutting environment during semiconductor wafer dicing promotes corrosion, particularly in wafers with copper, leading to non-sticking bonds and increased failure rates due to galvanic corrosion caused by standing water and electrochemical reactions.
Innovation Solution
A method and system that utilize a fluid ejector element to provide a continuous clearing fluid across the exposed side of the wafer during cutting, ensuring full coverage and removing standing liquids, thereby preventing corrosion by maintaining a flow of fluid across the wafer surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling fluid is applied during wafer cutting, then the cutting process can proceed, but standing water forms on the wafer surface promoting corrosion
Solution Approach 1:
The patent converts the harmful standing water into beneficial flowing water by implementing a fluid flow system that continuously moves the cooling fluid across the wafer surface. The fluid ejector element creates a flowing layer that prevents water accumulation, thereby eliminating the corrosion risk while maintaining the necessary cooling function.
Solution Approach 2:
The patent uses a fluid ejector element that utilizes hydraulic principles to generate a controlled flow of liquid across the wafer surface. By applying fluid pressure and creating a flowing layer, the system prevents standing water formation while maintaining cooling, thus resolving the contradiction between cooling necessity and corrosion prevention.
2Object-affected harmful factors
If a fluid ejector element is added to eliminate standing water, then corrosion is prevented, but device complexity increases
Solution Approach 1:
The fluid ejector element is designed to perform multiple functions simultaneously: it cools the wafer, prevents standing water formation, and eliminates corrosion. By combining these functions into a single component, the patent minimizes the increase in device complexity while achieving comprehensive protection against corrosion.
Solution Approach 2:
The fluid flow system is designed to be self-regulating, where the flowing fluid automatically prevents standing water formation without requiring additional control mechanisms. The system uses the fluid's own motion to eliminate corrosion risks, reducing the need for complex external control systems.
3Ease of manufacture
If cooling fluid is applied during cutting, then the cutting process can proceed, but electrochemical reactions occur causing non-sticking bonds
Solution Approach 1:
The patent converts the harmful electrochemical reactions caused by standing cooling fluid into a beneficial process by maintaining continuous fluid flow. The flowing fluid prevents water accumulation that would otherwise create electrochemical cells, thereby eliminating bond failures while preserving the cutting capability.
Solution Approach 2:
The patent implements continuous fluid flow across the wafer surface during the cutting process. This continuous action prevents the formation of standing water that would cause electrochemical reactions, ensuring both the cutting process can proceed and bond reliability is maintained throughout the manufacturing cycle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The continuous clearing fluid effectively reduces standing water, minimizing corrosion and associated failures by ensuring that no pools of liquid form on the wafer, thus enhancing the reliability of the wafer dicing process.
Implementation Method 1
applying a first fluid for cooling to the semiconductor wafer proximate where the spinning saw blade touches the semiconductor wafer
Implementation Method 2
applying a second fluid to substantially all of an exposed side of the semiconductor wafer... ejecting the second fluid across substantially all of the exposed side of the semiconductor wafer in a layer of fluid to remove any of the first fluid that would otherwise be standing on the first side
Data Source
AI summary
In one instance, a method of manufacturing an integrated circuit includes a method for dicing a semiconductor wafer that includes disposing the semiconductor wafer on a moveable cutting table, cutting the semiconductor wafer, and ejecting a clearing fluid across an exposed side of the semiconductor wafer, with full coverage across the semiconductor wafer, at least during the cutting of the semiconductor wafer. The ejecting clearing fluid is ejected to form a layer or membrane of fluid that clears or reduces other fluids from the exposed side or surface of the semiconductor wafer. Other aspects are presented.