Wafer Dicing Recipe Generation Using Kerf Center Alignment
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Solution Overview
Problem
The increasing complexity of integrated circuit packages, which include multiple device dies and different technologies, poses challenges in efficient and accurate dicing processes, leading to reduced manufacturing efficiency and throughput.
Innovation Solution
An automated wafer measurement and dicing process using a database-driven approach with a CCD camera system to identify and align dicing marks and kerf centers, allowing for automatic recipe generation and dicing on a single platform, reducing redundant operations and improving throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple device dies are integrated in the same package to achieve more functions, then device performance and functionality are improved, but the dicing process complexity increases and manufacturing efficiency decreases
Solution Approach 1:
The patent combines multiple dicing operations (measurement, marking, dicing) into a single integrated process performed on one wafer without removal. The system performs wafer measurement, kerf center determination, dicing mark formation, and actual dicing all in sequence on the same wafer platform, eliminating redundant handling and setup operations that would reduce throughput.
Solution Approach 2:
The dicing system is designed to perform multiple functions using a single integrated platform: wafer measurement, kerf center determination, dicing mark formation, and dicing execution. This multi-functional approach eliminates the need for separate specialized equipment and processes for each operation, thereby maintaining high manufacturing throughput while handling complex multi-die packages.
2Productivity
If automated dicing processes are implemented to improve manufacturing efficiency, then productivity increases, but the complexity of the dicing system increases
Solution Approach 1:
The patent merges multiple dicing operations (measurement, marking, dicing) into a single integrated process performed on one wafer without removal. The system performs wafer measurement, kerf center determination, dicing mark formation, and actual dicing all in sequence on the same wafer platform, eliminating redundant handling and setup operations that would reduce throughput.
Solution Approach 2:
The system uses the wafer's own features (scribble lines, dies) to automatically determine kerf centers and guide dicing operations. The wafer essentially guides its own dicing process by providing reference features that the system detects and uses for alignment, reducing the need for complex external positioning systems.
3Manufacturing precision
If manual intervention is used in the dicing process to ensure accuracy, then dicing precision is improved, but manufacturing efficiency and throughput are reduced
Solution Approach 1:
The patent replaces manual mechanical positioning and measurement with an automated optical measurement system that uses a CCD camera to capture wafer images. The system automatically identifies scribble lines and dies, calculates kerf centers, and determines dicing parameters through image processing and pattern recognition algorithms, eliminating the need for manual intervention while maintaining high precision.
Solution Approach 2:
The system performs real-time measurement and analysis of wafer features (scribble lines, dies) to automatically determine optimal dicing parameters and kerf centers. This closed-loop feedback approach ensures high dicing accuracy by continuously verifying wafer position and orientation before and during the dicing process, while maintaining automated operation for high throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the efficiency and accuracy of wafer dicing by eliminating redundant processes and improving alignment precision, thereby increasing the overall throughput and reducing manual intervention.
Implementation Method 1
a CCD camera system to identify and align dicing marks and kerf centers
Implementation Method 2
illustrate the dicing of wafers using a laser dicing process
Data Source
AI summary
A method includes forming a database, finding a plurality of dicing marks on a wafer, wherein patterns of the plurality of dicing marks match a pattern in the database, measuring a die pitch of the wafer according to a patch of adjacent two of the plurality of dicing marks, and determining kerf centers of the wafer based on the plurality of dicing marks. The measuring the die pitch and the determining the kerf centers are performed on a same wafer-holding platform. The wafer is diced into a plurality of dies, and the dicing is performed aligning to the kerf centers.