Wafer Dicing Layout With Scribe-Line Gaps for Delamination Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in wafer dicing processes, particularly in avoiding damage to layers and ensuring reliability during cutting, as existing methods can cause delamination, peeling, and heat absorption issues with the use of molding compounds and cutting tools.
Innovation Solution
A method involving the formation of a scribe line free of molding compound, using a stencil to apply a molding compound layer with gaps over the scribe line, and employing a laser for cutting to prevent heat absorption and maintain layer integrity, while subsequent layers are formed outside the scribe line to reduce delamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If molding compound is applied over the scribe line area, then the connectors are protected and encapsulated, but the molding compound absorbs laser heat during cutting causing delamination and peeling
Solution Approach 1:
The molding compound is selectively removed from the scribe line area where laser cutting occurs, while maintaining coverage over the connectors. This extraction approach eliminates the harmful heat absorption effect during laser cutting while preserving the protective and encapsulating function of the molding compound over the connectors.
Solution Approach 2:
The molding compound application is made non-uniform by creating a void or gap specifically in the scribe line area, while maintaining full coverage over the connectors. This local quality change allows different regions to have different properties: the connector region provides protection and encapsulation, while the scribe line region remains free of molding compound to prevent laser heat absorption.
2Manufacturing precision
If a laser is used to cut the wafer, then precise and clean cuts are achieved, but the laser generates heat that can damage the molding compound and cause delamination
Solution Approach 1:
The molding compound is removed from the laser cutting path in the scribe line area, eliminating the material that would absorb laser energy and convert it to heat. This allows the laser to cut through the wafer precisely without generating excessive heat that could damage the molding compound or cause delamination.
Solution Approach 2:
The void or gap in the molding compound layer over the scribe line acts as an intermediary that allows the laser beam to pass through without significant heat absorption. This mediator approach enables the laser to perform its cutting function precisely while avoiding the harmful thermal effects on the molding compound.
3Productivity
If the wafer is cut through the molding compound, then complete separation of dies is achieved, but the molding compound layers peel and delaminate during cutting
Solution Approach 1:
The molding compound is extracted or removed from the scribe line area to create a void that prevents the laser from cutting through the molding compound. This eliminates the peeling and delamination issues that occur when the laser attempts to cut through the molding compound, while still allowing complete die separation to occur through the wafer substrate.
Solution Approach 2:
The molding compound is preliminarily configured with gaps or voids in the scribe line areas before the laser cutting process begins. This preliminary action prevents the harmful interaction between the laser and molding compound during cutting, ensuring that the molding compound layers maintain their integrity and do not peel or delaminate.
4Reliability
If molding compound is applied in a continuous layer, then complete coverage and protection is provided, but heat absorption during laser cutting causes reliability issues
Solution Approach 1:
The molding compound layer is made non-uniform by creating localized voids or gaps specifically in the scribe line areas where laser cutting occurs. This local quality change allows the molding compound to maintain its protective function over the connectors while eliminating heat absorption in the laser cutting path, thereby reducing laser energy loss and improving overall reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise and reliable cutting of wafers into individual dies without damaging the layers, maintaining the integrity of the molding compound and reducing the risk of delamination, thereby enhancing die reliability and efficiency in semiconductor processing.
Implementation Method 1
The substrate is cut in the scribe line with a laser
Implementation Method 2
A stencil is used to form the molding compound layer with gaps over the scribe line
Data Source
AI summary
A semiconductor device includes a plurality of connectors and at least one insulating layer disposed over a semiconductor substrate. A molding layer extends around the plurality of connectors. A sidewall of the molding layer that is closest to a scribe line is offset from the scribe line.