Wafer Die Cleaning and Pre-Bonding With Segmented Chamber Units

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Solution Overview

Problem

Conventional wafer processing apparatuses face challenges in efficiently cleaning foreign materials from gaps between dies, leading to increased cleaning time and structural complexity, along with coupling errors and potential damage from processing solution leakage.

Innovation Solution

The apparatus includes separate chamber units for processing and cleaning wafer parts, utilizing ultrasonic cleaning modules, ionizers, and an expander module to widen gaps between dies, allowing for effective cleaning and pre-bonding of dies while simplifying the structure and reducing manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a sealing ring is coupled to an upper portion of a rotary table, then the structure can contain processing solution, but the coupling process is cumbersome and coupling completion state is not constant resulting in coupling errors

Engineering Contradiction:

Improvesealing performanceVSAvoidcoupling structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces the conventional mechanical coupling method with a magnetic coupling system. The sealing ring includes a magnetic ring that magnetically couples with a magnetic attraction component on the rotary table, eliminating the need for complex mechanical fastening while ensuring consistent coupling state and reliable sealing performance.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the coupling mechanism from mechanical to magnetic field-based interaction. By utilizing magnetic attraction force, the system achieves reliable coupling without complex mechanical structures, and the coupling strength can be controlled by adjusting magnetic properties rather than mechanical tightness.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If wafer cleaning time is extended to remove foreign materials from gaps between dies, then cleaning effectiveness improves, but cleaning time increases

Engineering Contradiction:

Improvecleaning effectivenessVSAvoidcleaning time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent employs an ultrasonic vibration module that generates high-frequency vibrations to agitate the cleaning solution and enhance its penetrating ability into gaps between dies. This mechanical vibration accelerates the removal of foreign materials, achieving effective cleaning in reduced time compared to conventional static cleaning methods.

Inventive Principle:

Principle #18Mechanical vibration

Solution Approach 2:

The ultrasonic vibration module utilizes cavitation effects where cleaning solution undergoes rapid phase transitions between liquid and vapor states during ultrasonic cycles. This creates micro-jets and shock waves that effectively dislodge and remove foreign materials from difficult-to-reach areas between dies.

Inventive Principle:

Principle #36Phase transitions

3Device complexity

If wafer processing is performed in a single chamber, then the structure is simple, but cleaning efficiency is insufficient and foreign materials remain in gaps between dies

Engineering Contradiction:

Improvechamber structureVSAvoidcleaning efficiency

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The patent divides the processing system into functionally separate chamber units: a processing chamber for wafer processing and a cleaning chamber for dedicated cleaning operations. This segmentation allows each chamber to be optimized for its specific function, with the cleaning chamber housing specialized equipment like the ultrasonic vibration module, thereby achieving superior cleaning efficiency without excessive overall complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The cleaning chamber is designed as a multi-functional unit that can perform both cleaning operations and serve as a processing chamber when needed. The chamber structure itself is universal, but the ultrasonic vibration module provides enhanced cleaning capability specifically when required, making the system adaptable without requiring completely separate dedicated chambers.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution significantly reduces cleaning time, improves cleaning efficiency, and enhances processing performance by effectively removing foreign materials and preventing structural damage, while simplifying the apparatus structure and reducing defects.

Implementation Method 1

a second ultrasonic cleaning module configured to spray a cleaning solution onto the second wafer part and apply ultrasonic waves to the cleaning solution to ultrasonically vibrate the cleaning solution

Methodology Applied

Scientific EffectUltrasonic vibration: Ultrasonic Vibration

Data Source

PatentUS12261076B2Wafer processing apparatus and wafer processing method

Publication Date: 2025.03.25 ZEUS

AI summary

A wafer processing apparatus of the present invention includes a first chamber unit in which a first wafer part including a retainer ring portion and a plurality of sawn first dies is processed, a second chamber unit in which a second wafer part including a wafer part or a carrier substrate is processed, and a third chamber unit in which the first dies of the first wafer part processed in the first chamber unit and the second wafer part processed in the second chamber unit are stacked and pre-bonded.