Wafer and Die Shape Conditioning for Precise Bonding
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Solution Overview
Problem
Existing conditioning techniques for wafers and dies in semiconductor technology are not optimal, particularly for wafer-to-wafer or wafer-to-die bonding, as they often fail to effectively minimize or eliminate undesired mechanical and surface properties, and can be unsuitable or non-customizable for specific processing needs.
Innovation Solution
Applying a plurality of local modifications within the surface layer and/or substrate of wafers and dies, using methods like laser pulses, to adjust the shape and facilitate bonding, while preserving sensitive process structures and allowing for precise, flexible, and customizable 3-dimensional shape control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional conditioning techniques (substrate clean, plasma treatment, thermal treatment, CMP) are applied to minimize undesired mechanical and surface properties, then bonding quality may be improved, but the techniques are not optimal and fail to effectively eliminate undesired properties while being unsuitable for specific processing needs
Solution Approach 1:
The patent applies local modifications at specific positions within the wafer or die using a movable application unit. The system determines individual modification parameters based on measured shape deviations at different locations, enabling localized conditioning tailored to specific regions rather than uniform treatment across the entire substrate.
Solution Approach 2:
The conditioning system is made dynamic through the movable application unit that can be positioned at different locations on the wafer or die. The system adapts its operation in real-time based on measured shape characteristics, allowing customization for specific processing needs and dynamic adjustment of modification parameters during the conditioning process.
2Manufacturing precision
If local modifications are applied within the substrate to adjust shape, then shape control precision is improved, but sensitive process structures may be harmed
Solution Approach 1:
The patent introduces a surface layer as an intermediary between the modification application unit and the substrate. Local modifications are applied within this surface layer rather than directly in the substrate, preventing damage to sensitive process structures while still achieving effective shape control through stress/strain induction in the surface layer that translates to substrate shape adjustment.
Solution Approach 2:
The patent segments the modification target into two distinct layers: the surface layer where modifications are applied, and the substrate where shape control is needed but must be protected. This segmentation allows independent optimization - the surface layer absorbs the modification effects while the substrate maintains its structural integrity and sensitive process structures.
3Manufacturing precision
If conditioning is applied early in the fabrication process to a bare substrate, then shape control can be achieved, but processing steps must be re-engineered and it is less flexible
Solution Approach 1:
The patent applies conditioning as a preliminary action before bonding operations, but unlike conventional approaches, it can be performed at any stage after the wafer or die structure is formed. The local modification technique prepares the surface for bonding by inducing appropriate stress/strain patterns without requiring re-engineering of earlier fabrication steps, as it works with already-processed wafers and dies.
Solution Approach 2:
The system changes parameters dynamically based on measured shape characteristics. Instead of requiring fixed, pre-determined conditioning parameters, the system adjusts modification parameters (such as laser pulse energy, duration, or modification density) based on actual shape measurements, enabling effective conditioning without re-engineering processing steps for different wafer types or shapes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables precise and flexible shape control of wafers and dies, improving bonding quality by reducing undesired properties and ensuring consistent bonding parameters, even in the presence of complex process structures.
Implementation Method 1
applying a plurality of local modifications within the surface layer and/or substrate, using methods like laser pulses
Implementation Method 2
applying a plurality of local modifications within the at least one surface layer; and/or applying a plurality of local modifications within the substrate, via the at least one surface layer
Data Source
AI summary
A method for adjusting a shape of a wafer and/or die having a substrate and at least one surface layer comprises applying a plurality of local modifications in the wafer and/or die, wherein applying the plurality of local modifications comprises applying a plurality of local modifications within the at least one surface layer and/or applying a plurality of local modifications within the substrate, via the at least one surface layer.