Wafer Carrier Disc Alignment for Precise Robotic Wafer Placement
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Solution Overview
Problem
The existing wafer processing systems face challenges in efficiently and precisely placing fragile wafers onto wafer discs, requiring labor-intensive operations and compromising processing efficiency due to the fragility and precision requirements of robotic handling.
Innovation Solution
A wafer carrier disc installation/uninstallation device and method utilizing robotic arms with image capturing assemblies, wafer locating mechanisms, and correction mechanisms to automate the precise placement and alignment of wafers on carrier discs, ensuring high precision and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If robotic arms are used to place wafers onto wafer discs, then labor cost is reduced and processing efficiency is enhanced, but the risk of damaging fragile wafers increases due to high processing precision requirements
Solution Approach 1:
A wafer holding mechanism with a suction cup is introduced as an intermediary between the robotic arm and the wafer. The suction cup gently holds the wafer without direct mechanical contact from the robotic gripper, eliminating the risk of mechanical damage while enabling automated handling. This mediator allows the robotic system to handle fragile wafers safely.
Solution Approach 2:
The patent replaces traditional mechanical grippers with a suction-based holding mechanism. Instead of using mechanical force to grasp and move the wafer, the system uses vacuum suction to hold the wafer, which is gentler and reduces the risk of damage to the fragile semiconductor substrate.
2Manufacturing precision
If manual operations are used for placing and positioning wafers, then processing precision can be maintained, but labor cost increases and processing efficiency decreases
Solution Approach 1:
The system incorporates an image capturing assembly that automatically captures images of the wafer and wafer disc, and a correction mechanism that automatically adjusts positioning errors. This self-correcting system eliminates the need for manual inspection and adjustment, maintaining high precision while enabling automated high-speed operation.
Solution Approach 2:
The patent implements a feedback loop where the image capturing assembly continuously monitors the position of the wafer and wafer disc, and the correction mechanism automatically adjusts for any deviations from the correct position. This closed-loop control system ensures high precision placement while operating at automated speeds.
3Productivity
If multiple wafer discs are disposed on a carrier disc for mass processing, then processing efficiency is enhanced, but the complexity of positioning and locating wafers increases
Solution Approach 1:
The patent incorporates correction marks on both the wafer and wafer disc, and uses an image capturing assembly to detect these marks before processing. By performing preliminary positioning based on these marks, the system simplifies the subsequent handling of multiple wafer discs on the carrier disc, as each disc can be quickly located and aligned using the same correction mark detection method.
Data Source
AI summary
A wafer carrier disc installation/uninstallation device and an installation/uninstallation method thereof. The installation/uninstallation device includes a first robotic arm 1, a second robotic arm 2, a carrier disc 3, a main correction mechanism 4, a wafer correction mechanism 5 and a material rest mechanism 6. The carrier disc 3, the main correction mechanism 4, the wafer correction mechanism 5 and the material rest mechanism 6 are positioned within the moving range of the first and second robotic arms 1 and 2. The first robotic arm 1 drives an image capturing assembly 11 and a wafer locating member installation/uninstallation mechanism 12 to move. The second robotic arm 2 drives a wafer taking/placing mechanism 21 to move. Multiple wafer discs 31 are disposed on the carrier disc 3. The main correction mechanism 4 corrects the image capturing assembly 11, the wafer locating member installation/uninstallation mechanism 12 to true operation positions.