Wafer Dividing via Tape Expansion and Cooling
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Solution Overview
Problem
Existing methods for dividing semiconductor wafers with polymer protective films or insulating films along predetermined lines result in reduced silicon substrate strength and jagged film surfaces, compromising device quality.
Innovation Solution
A method and apparatus involving a frame holding and cooling system with an adhesive tape, where the wafer is cooled to +5 to −20° C and divided along lattice pattern lines by expanding the adhesive tape, ensuring the polymer film is divided without stretching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the wafer is divided by expanding the protective tape or insulating film, then the silicon substrate is divided along the dividing lines, but the polymer film is stretched and not divided, resulting in jagged divided surfaces
Solution Approach 1:
The patent applies parameter changes by cooling the wafer to low temperature (e.g., liquid nitrogen temperature or refrigerated temperature) before division. This temperature change modifies the mechanical properties of both the silicon substrate and polymer film, making the polymer film more brittle and capable of being divided along with the substrate without stretching or forming jagged surfaces.
Solution Approach 2:
The patent employs preliminary action by performing the cooling treatment on the wafer before the division process. This preliminary cooling prepares both the silicon substrate and polymer film for simultaneous division, ensuring that the polymer film will fracture cleanly along the dividing lines when the substrate is divided, rather than stretching or creating jagged edges.
2Manufacturing precision
If the polymer protective film is stretched during division, then the silicon substrate is divided, but the film surface becomes jagged, reducing device quality
Solution Approach 1:
The patent changes the temperature parameter of the wafer and adhesive tape to low temperatures, which fundamentally alters the mechanical behavior of the polymer film during division. This parameter change eliminates the stretching and jagged surface formation that occur at room temperature, achieving clean division without increasing process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively divides the polymer film along predetermined lines without stretching, maintaining the integrity of the silicon substrate and improving device quality by ensuring precise and clean separation.
Implementation Method 1
a frame cooling step for cooling the wafer that is affixed to the surface of the adhesive tape mounted on the annular frame
Data Source
AI summary
A method of dividing, along lattice pattern-like dividing lines, a wafer which has the lattice pattern-like dividing lines and a polymer film on the front surface of a substrate and is processed to allow for division along the dividing lines, the method comprising a frame holding step for putting the wafer on the surface of an adhesive tape mounted on an annular frame; a wafer cooling step for cooling the wafer that is affixed to the surface of the adhesive tape mounted on the annular frame; and a diving step for dividing the wafer along the dividing lines by expanding the adhesive tape to which the cooled wafer is affixed.