Wafer Dividing via Segmented Tape Tension
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Solution Overview
Problem
Current wafer dividing methods, such as using a dicer or laser processing, face challenges with high hardness substrates like sapphire, leading to reduced productivity and irregular divisions due to random tensile forces applied by protective tapes, which can break test metal patterns and contaminate devices.
Innovation Solution
A wafer dividing apparatus with a tape holding mechanism and suction-holding members that apply tensile force perpendicular to the dividing lines, allowing precise and efficient division of wafers with reduced strength by moving the suction-holding members in opposite directions, enabling simultaneous division along multiple lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a protective tape is expanded to give tensile force to the wafer, then the wafer can be divided along dividing lines, but tensile force acts radially in random directions causing irregular division and undivided areas to remain
Solution Approach 1:
The protective tape is divided into multiple separate tapes, each applied to specific regions of the wafer. This segmentation allows independent control of tensile force application in different directions, enabling precise division along lattice-pattern dividing lines without random radial forces that cause irregular division.
Solution Approach 2:
Different regions of the wafer receive different treatments by applying protective tapes to specific areas only. This local quality approach ensures that tensile force is applied precisely where needed for division, maintaining division precision while avoiding unnecessary forces on other regions.
2Productivity
If a protective tape is expanded to give tensile force to the wafer, then the wafer can be divided along dividing lines, but irregular force acts on test metal patterns causing them to break jaggedly and cause contamination
Solution Approach 1:
The protective tape system is segmented into multiple separate tapes applied to specific regions, allowing controlled tensile force application that avoids concentrating irregular forces on test metal patterns. This prevents jagged breaking and contamination of sensitive structures.
Solution Approach 2:
The segmented protective tapes act as intermediaries that mediate the force application process. By controlling where and how tensile force is applied through these intermediaries, the system protects test metal patterns from direct exposure to harmful irregular forces while still enabling effective wafer division.
3Manufacturing precision
If a cutting blade with thickness of 20 μm is used, then the dividing lines must have a width of about 50 μm, but the area ratio of streets to device becomes 14% reducing productivity
Solution Approach 1:
The mechanical cutting blade system is replaced with a tensile force application system using protective tapes. This substitution eliminates the need for wide physical cutting blades, allowing dividing lines to be much narrower and reducing the street area ratio from 14% to a minimal value, thereby improving device yield while maintaining division precision.
4Manufacturing precision
If laser processing is used to form deteriorated layers, then the wafer can be divided by exerting external force, but the process is time-consuming and reduces productivity
Solution Approach 1:
The protective tapes are applied in advance to the wafer surface before division is needed. This preliminary action prepares the wafer for easy division by pre-establishing the tensile force application mechanism, eliminating time-consuming laser processing steps and significantly improving wafer division speed while maintaining precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus ensures precise and efficient division of wafers along reduced-strength dividing lines, improving productivity and maintaining the integrity of test metal patterns, thereby enhancing the quality and yield of semiconductor and optical device production.
Implementation Method 1
a first suction-holding member and a second suction-holding member, which suction-hold the wafer supported on the tape holding means through the protective tape
Data Source
AI summary
A wafer dividing apparatus for dividing a wafer whose strength is reduced along a plurality of dividing lines, along the dividing lines, which comprises a tape holding means for holding a protective tape affixed to one side of the wafer; and wafer dividing means, each comprising a plurality of tension application means comprising a first suction-holding member and a second suction-holding member for suction-holding the wafer held on the tape holding means through the protective tape on both sides of a dividing line, and moving means for moving the first suction-holding members and the second suction-holding members in such directions that they separate from each other.