Wafer Wet Cleaning Using Drained Chemistry Contamination Analysis
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Solution Overview
Problem
Current wafer cleaning processes in semiconductor manufacturing are inefficient due to the lack of real-time contamination level monitoring, leading to increased processing time and costs as wafers are removed from the cleaning tool for separate analysis, impacting overall chip production throughput.
Innovation Solution
Implementing a system that collects and analyzes 'consumed' wet etch chemistry during the cleaning process to monitor contamination levels in real-time, allowing for immediate adjustments to the cleaning parameters based on the analyzed data, thereby optimizing the cleaning process for each wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If wafers are removed from the cleaning tool for separate contamination analysis, then contamination level monitoring is achieved, but processing time increases and throughput decreases
Solution Approach 1:
The patent combines the contamination analysis function with the cleaning tool itself by integrating a particle detector and chemistry analysis system within the cleaning chamber. This allows contamination monitoring to occur simultaneously with the cleaning process, eliminating the need to remove wafers for separate analysis and thereby maintaining high throughput while achieving real-time contamination level monitoring.
Solution Approach 2:
The system enables continuous monitoring of contamination levels during the cleaning process by analyzing the chemistry of the cleaning solution in real-time and detecting particles in the chamber. This continuous action allows for immediate parameter adjustments without interrupting the cleaning operation, thus maintaining productivity while achieving precise contamination measurement.
2Manufacturing precision
If cleaning process time is extended to ensure proper cleaning, then cleaning quality improves, but throughput decreases
Solution Approach 1:
The system implements real-time feedback by continuously monitoring contamination levels through particle detection and chemistry analysis during the cleaning process. Based on this feedback, the cleaning parameters can be dynamically adjusted to optimize cleaning quality while minimizing processing time, thereby maintaining high throughput without compromising cleaning precision.
Solution Approach 2:
The cleaning process parameters such as chemistry composition, temperature, and processing time are made dynamic and adjustable in real-time based on monitored contamination levels. This allows the system to adapt the cleaning duration and intensity to the actual needs of each wafer, ensuring proper cleaning quality while avoiding unnecessary extensions that would reduce throughput.
3Productivity
If real-time monitoring and dynamic adjustments are implemented, then cleaning efficiency improves, but device complexity increases
Solution Approach 1:
The cleaning tool is designed with multi-functionality by integrating particle detection, chemistry analysis, and real-time parameter adjustment capabilities into a single system. This universal design allows the same device to perform cleaning, monitoring, and control functions simultaneously, improving cleaning efficiency without requiring separate standalone systems that would increase overall device complexity.
Data Source
AI summary
The present disclosure describes a wafer cleaning process in which a drained cleaning solution, which is used to remove metal contaminants from the wafer, is sampled and analyzed to determine the concentration of metal ions in the solution. The wafer cleaning process includes dispensing, in a wafer cleaning station, a chemical solution on one or more wafers; collecting the dispensed chemical solution; determining a concentration of contaminants in the chemical solution; in response to the concentration of the contaminants being greater than a baseline value, adjusting one or more parameters in the cleaning process; and in response to the concentration of the contaminants being equal to or less than the baseline value, transferring the one or more wafers out of the wafer cleaning station.