Wafer Drying Gas Feedback for Real-Time Contamination Control
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Solution Overview
Problem
Current semiconductor wafer cleaning processes are inefficient as they do not allow for real-time detection of contaminants during the drying phase, leading to increased production costs and reduced throughput due to the need for post-drying sampling and potential reworking of wafers.
Innovation Solution
A method that involves real-time detection of airborne molecular contamination in the drying gas as a feedback parameter to adjust the wafer drying process, using a system that collects and analyzes the drying gas for contaminants and compares the concentration to an established baseline, allowing for immediate adjustments such as additional rinses or continued processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If real-time detection of airborne molecular contamination is implemented during drying, then manufacturing precision and reliability are improved, but device complexity increases
Solution Approach 1:
The system continuously monitors airborne molecular contamination in the drying gas and uses this real-time feedback to control the drying process. The monitor detects contaminant levels and sends signals to the controller, which adjusts drying parameters accordingly, creating a closed-loop feedback system that improves precision while managing complexity through automated control.
Solution Approach 2:
The patent replaces manual post-drying sampling and inspection with an automated airborne molecular contamination monitoring system. The mechanical/manual process of taking samples after drying is substituted with continuous real-time detection during the drying process, using analytical instruments to monitor contamination levels automatically.
2Manufacturing precision
If post-drying sampling and potential reworking is performed, then manufacturing precision is maintained, but productivity decreases
Solution Approach 1:
The system performs contamination detection during the drying process itself rather than after completion. By monitoring airborne molecular contamination in real-time, the system can identify and address contamination issues while the wafer is still being processed, eliminating the need for separate post-drying sampling and potential reworking steps.
Solution Approach 2:
The drying process continues uninterrupted while contamination is monitored in real-time. Unlike discrete post-drying inspection steps that halt production, the monitoring occurs continuously during the drying operation itself, maintaining continuous useful action and improving throughput while ensuring contamination standards are met.
3Productivity
If real-time monitoring and adjustment is implemented, then productivity is improved, but device complexity increases
Solution Approach 1:
The real-time monitoring system provides continuous feedback on contamination levels, enabling immediate process adjustments. The controller receives data from the airborne molecular contamination monitor and automatically adjusts drying parameters, creating an efficient feedback loop that improves productivity through automated real-time control.
Solution Approach 2:
The system performs self-monitoring and self-adjustment of the drying process. The airborne molecular contamination monitor and controller work together to automatically detect and correct contamination issues without external intervention, allowing the system to service itself and maintain optimal performance continuously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables real-time monitoring and adjustment of the drying process, reducing the need for post-drying sampling and reworking, thereby improving production efficiency and reducing costs by ensuring wafers meet contamination standards before proceeding to the next processing step.
Implementation Method 1
analyzer configured to detect contamination in the drying gas and determine the concentration of the contamination in the drying gas
Data Source
AI summary
The present disclosure is directed to a wafer drying system and method that detects airborne molecular contaminants in a drying gas as a feedback parameter for a single wafer or multi-wafer drying process. For example, the system comprises a wafer drying station configured to dispense a drying gas over one or more wafers to dry the one or more wafers, a valve configured to divert the drying gas to a first portion and a second portion, and an exhaust line configured to exhaust the first portion of the drying gas. The system further comprises a detector configured to receive the second portion of the drying gas and to determine a real time property of the second portion of the drying gas, and a control unit configured to control a feedback operation of the wafer drying station based on the real time property of the second portion of the drying gas.