Wafer Drying Support Surfaces for Residue-Free Drainage
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Solution Overview
Problem
Existing methods for drying disc-shaped substrates, such as semiconductor wafers, leave residual liquid residues that lead to contamination and particle formation, reducing substrate quality.
Innovation Solution
A device with hydrophilic, microstructured surfaces adjacent to support positions facilitates the drainage of liquid residues by capillary action and gravity, transferring them away from the substrate during the drying process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional drying methods are used, then the drying process is simple, but liquid residues remain on the substrate surface causing contamination and particle formation
Solution Approach 1:
The drying device incorporates localized hydrophilic microstructured surfaces at specific support positions rather than treating the entire device surface uniformly. This local modification creates targeted liquid residue removal zones where capillary forces efficiently draw liquid away from the substrate edge, improving surface quality without requiring complete device redesign
Solution Approach 2:
The hydrophilic microstructured surface acts as an intermediary between the liquid residue and the substrate. This intermediate surface structure facilitates liquid transfer through capillary forces, effectively mediating the removal process and preventing direct liquid-substrate contact that causes contamination
2Productivity
If more aggressive liquid removal methods are used, then liquid residues are removed faster, but more particles are generated from the liquid
Solution Approach 1:
The invention converts the potentially harmful liquid residue into a beneficial flow by using its own surface tension and the capillary forces of the microstructured surface to guide it away from the substrate. The liquid's natural properties are harnessed to achieve removal without aggressive mechanical or thermal methods that would generate particles
Solution Approach 2:
The invention replaces mechanical wiping or blowing methods with capillary action-based liquid transfer. This substitution eliminates mechanical contact that could generate particles while maintaining efficient liquid removal through the microstructured surface's capillary forces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively reduces the number of particles on the substrate by efficiently removing residual liquid, improving substrate quality and cleanroom atmosphere.
Implementation Method 1
at least a portion of the sloping surfaces adjoining the support positions is hydrophilic at least in a portion of its upper section and has a periodic microstructure
Implementation Method 2
transferred from the liquid into a gas space containing vapor that does not condense on the substrates and reduces the surface tension of the liquid residues adhering to the substrates
Implementation Method 3
surfaces of the body which slope downwards from the support positions
Data Source
Figure 1
Figure 2a~2c
Figure 3a~3d
AI summary
A device for drying disc-shaped substrates (8), comprising a body (1) with a horizontal main extension direction (2) and a cross-sectional profile (3) transverse to the main extension direction (2), which cross-sectional profile tapers upwards in the vertical direction, wherein the body (1) has a plurality of support positions (5) on its upper side, which support positions are suitable for supporting disc-shaped substrates (8) arranged in a plurality of support positions (5) along the main extension direction (2), adjoining the plurality of support positions (5) are surfaces of the body which slope downwards starting from the support positions (5), and at least some of the sloping surfaces adjoining the support positions (5) are hydrophilic at least in a part (7) of their upper section and have a periodic microstructure.