Wafer Edge Inspection for Bonding Region Imaging in Multi-Layer Stacks
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Solution Overview
Problem
Existing semiconductor inspection methods struggle to effectively inspect the bonding regions between layers in multi-stack packages due to the bonding layer obstructing clear imaging, leading to incomplete data collection and potential manufacturing defects.
Innovation Solution
A semiconductor inspection tool system that uses dedicated illumination setups and sensors to illuminate and capture sensing data from the bonding region between layers, enabling clear imaging and measurement of bonding region dimensions and surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If typical side and/or top and/or bottom edge imaging sensors are used to capture images of the bonding region, then the inspection process is simple and fast, but the bonding layer obstructs clear imaging and indicative layer data cannot be observed
Solution Approach 1:
The patent introduces a cross-sectional viewing dimension by positioning sensors radially outward from the bonding region and using oblique illumination. This allows imaging through the bonding layer interface from the side, converting a 3D obscuration problem into a 2D cross-sectional view where the bonding layer becomes transparent to the imaging path.
Solution Approach 2:
The patent uses the wafer edge and bonding region interface as an intermediary imaging plane. By focusing on this intermediate region where light can penetrate and reflect, the system captures indicative data about the bonding layer quality without requiring direct transmission through the entire bonding layer thickness.
2Manufacturing precision
If the bonding region is inspected using conventional imaging methods, then the inspection speed is high, but the bonding region dimensions prevent effective inspection of the bonding layer's radial outer aspects
Solution Approach 1:
The patent applies localized oblique illumination specifically targeted at the bonding region interface, concentrating lighting resources where needed to enhance contrast and visibility of the bonding layer edges. This local enhancement allows precise inspection of critical radial outer aspects without requiring global system changes that would reduce throughput.
Solution Approach 2:
The system inspects only the critical bonding region interface and radial outer aspects rather than attempting to image the entire bonding layer volume. This partial inspection approach focuses resources on the most quality-critical areas, maintaining high throughput while achieving sufficient inspection accuracy for manufacturing decisions.
3Loss of information
If multiple illumination setups with different radiation parameters are used to illuminate the bonding region and edges, then comprehensive sensing data is obtained, but the device complexity increases
Solution Approach 1:
The patent designs the illumination system with multiple radiation parameters (wavelengths, angles, intensities) that can be selectively activated based on inspection needs. The same physical illumination apparatus serves multiple functions by adjusting parameters, reducing the need for separate dedicated illumination systems for different inspection tasks.
Solution Approach 2:
The illumination system dynamically adjusts radiation parameters during inspection operations, changing wavelength, angle, or intensity based on which region is being inspected (bonding region vs. edge). This dynamic parameter adjustment allows one flexible system to replace multiple fixed systems, obtaining comprehensive data without proportionally increasing hardware complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables comprehensive inspection of bonding regions, providing detailed layer data, defect detection, and process monitoring, enhancing manufacturing yield and quality control.
Implementation Method 1
providing at least one illumination radiation being configured to illuminate the bonding region volume
Implementation Method 2
collecting reflected electromagnetic radiation from the bonding region and generating at least one sensing data
Data Source
AI summary
A semiconductor inspection tool system is disclosed. The system comprises a first illumination setup for generating at least one first illumination radiation and for directing the at least one first illumination radiation to at least one bonding region non-filled volume formed between two layers of a multi-layer stack. The system also comprises a second illumination setup being for generating at least one second illumination radiation and for directing the at least one second illumination radiation at multi-layer stack edges. The second illumination radiation is configured for illuminating at least a normal edge of at least two layers, the second illumination setup has different radiation parameters than the first illumination setup. The system further includes a bonding region sensor unit for collecting reflected electromagnetic radiation from a bonding region volume and generating at least one sensing data being indicative of the bonding region.