Wafer Edge Inspection Illumination for Bonding Region Visibility
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Solution Overview
Problem
Current wafer inspection technologies face challenges in effectively inspecting the bonding region between layers in multi-stack packages, as the bonding layer's radial outer aspects and top and bottom surfaces are difficult to visualize due to limited light penetration and reflection, leading to incomplete data on bonding layer dimensions and defects.
Innovation Solution
A semiconductor inspection tool system is developed, featuring a first illumination setup to direct radiation at the bonding region non-filled volume and a second setup to illuminate the edges, along with a bonding region sensor unit to collect and generate sensing data, enabling clear inspection of bonding region dimensions, surfaces, and defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If typical side and/or top and/or bottom edge imaging sensors are used to capture images of the bonding region, then the inspection process is simple and fast, but the bonding region appears as a black line due to insufficient light penetration and reflection, making it impossible to observe indicative layer data
Solution Approach 1:
The illumination system is segmented into multiple independent illumination setups, each targeting specific regions (bonding region non-filled volume, edges, interfaces). This allows optimized illumination for each region without requiring a completely complex new system, as each segment can be independently configured and controlled.
Solution Approach 2:
Different illumination characteristics are applied to different regions: the first illumination setup provides optimized lighting for the bonding region non-filled volume, while the second setup provides optimized lighting for edges and interfaces. This local optimization enables clear imaging of previously dark regions without uniformly increasing system complexity throughout.
2Loss of information
If multiple illumination setups with different radiation parameters are used to illuminate the bonding region and edges, then comprehensive sensing data of bonding layer dimensions and defects is obtained, but the device complexity increases
Solution Approach 1:
The multiple illumination setups are designed to serve multiple functions: the first illumination setup illuminates the bonding region non-filled volume for detecting voids and delamination, while also providing complementary information for bonding layer dimension measurement. The second setup illuminates edges and interfaces, providing data that complements the first setup. This multi-functionality reduces information loss without proportionally increasing complexity.
Solution Approach 2:
The system uses sensing data from multiple illumination setups to provide feedback for comprehensive analysis. The processing unit integrates information from both illumination setups, using the combined data to accurately determine bonding layer dimensions, detect defects, and identify process anomalies, thereby compensating for the increased device complexity through intelligent data integration.
3Measurement precision
If high-power focused light radiation is directed at the bonding region's inner aspects, then clear images of the bonding region are obtained, but the illumination system becomes more complex and requires precise alignment
Solution Approach 1:
The illumination setups are configured to direct light at predetermined angles and positions relative to the bonding region and wafer stack. The first illumination setup is pre-configured to target the bonding region non-filled volume, and the second setup is pre-configured to target edges and interfaces. This preliminary configuration simplifies operation during actual inspection, as the system is pre-aligned rather than requiring real-time adjustment.
Solution Approach 2:
The illumination system operates from multiple spatial dimensions and angles simultaneously. The first illumination setup provides illumination from one dimension targeting the bonding region interior, while the second setup provides illumination from another dimension targeting edges and interfaces. This multi-dimensional approach enables comprehensive imaging without requiring complex alignment adjustments, as each dimension is independently optimized.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system provides comprehensive data on bonding layer parameters, defects, and process anomalies, enhancing the accuracy of wafer inspection and manufacturing process control by allowing for the detection of defects and variations along the wafer edges.
Implementation Method 1
not enough amount of light can penetrate the bonding region
Implementation Method 2
or is reflected from the inner aspects of the bonding region
Implementation Method 3
collecting reflected electromagnetic radiation from a bonding region and generating at least one sensing data
Data Source
AI summary
A semiconductor inspection tool system is disclosed. The system comprises a first illumination setup for generating at least one first illumination radiation and for directing the at least one first illumination radiation to at least one bonding region non-filled volume formed between two layers of a multi-layer stack. The system also comprises a second illumination setup being for generating at least one second illumination radiation and for directing the at least one second illumination radiation at multi-layer stack edges. The second illumination radiation is configured for illuminating at least a normal edge of at least two layers, the second illumination setup has different radiation parameters than the first illumination setup. The system further includes a bonding region sensor unit for collecting reflected electromagnetic radiation from a bonding region volume and generating at least one sensing data being indicative of the bonding region.