Wafer Edge Inspection Using Color Profiles for EBR Measurement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing wafer inspection process for the edge region of semiconductor wafers requires separate apparatuses, leading to increased time and cost due to the need for transferring wafers between different machines for inspection and processing.
Innovation Solution
A method that involves acquiring a color image of the wafer, generating color profiles by analyzing red, green, blue, and gray level values, and calculating color ratios to detect the side surface of a layer on the wafer, allowing for the calculation of the distance between the layer and the wafer surface without the need for a separate inspection apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a separate EBR inspection apparatus is used to inspect the edge region of the wafer, then the inspection precision is improved, but the time and cost increase due to transferring the wafer between different apparatuses
Solution Approach 1:
The patent combines the EBR inspection function with the existing deposition apparatus by equipping the deposition apparatus with an imaging device. This allows the inspection process to be performed at the same location where the layer is formed, eliminating the need to transfer the wafer to a separate inspection apparatus while maintaining inspection precision through image-based measurement of the EBR region
Solution Approach 2:
The deposition apparatus is designed to perform multiple functions: both the deposition process and the EBR inspection process. By integrating an imaging device into the deposition apparatus, the same equipment can sequentially perform layer formation and edge region inspection without requiring a dedicated inspection apparatus, thereby reducing transfer time and costs
2Reliability
If a separate EBR inspection apparatus is used, then the inspection reliability is improved, but the manufacturing cost increases due to additional equipment requirements
Solution Approach 1:
The patent merges the inspection function into the existing deposition apparatus by adding an imaging device. This integration allows the same equipment to perform both deposition and inspection tasks, reducing the total number of apparatuses required while maintaining inspection reliability through systematic image acquisition and analysis procedures
Solution Approach 2:
The deposition apparatus is transformed into a multi-functional system that can perform both layer deposition and EBR inspection. This universality eliminates the need for separate dedicated inspection equipment, thereby reducing manufacturing costs while preserving inspection reliability through the use of standardized imaging and analysis methods
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the time and cost associated with wafer inspection while improving the reliability of the results by integrating the inspection process into the existing manufacturing workflow, eliminating the need for additional equipment.
Implementation Method 1
an apparatus for performing the inspection process on the EBR region may irradiate a light onto the EBR region, detect a light reflected from the EBR region
Data Source
AI summary
A wafer inspection method includes acquiring an inspection image from an edge region of a wafer, generating a color profile of the inspection image in a radial direction of the wafer, detecting a side surface of a layer formed on the wafer based on a change in the color profile in a first direction from a side surface of the wafer toward a center of the wafer, and calculating a distance between the side surface of the layer and the side surface of the wafer.