Semiconductor Wafer Support with Tapered Edge Cooling Path
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The outer circumferential portion of a wafer in semiconductor manufacturing apparatus does not receive sufficient cooling during processing, leading to high temperatures due to insufficient thermal conduction from the cooling plate.
Innovation Solution
The connection part between the wafer placement surface and the focus ring placement surface is designed as a lateral surface of a circular truncated cone, increasing the number of thermal paths from the outer circumferential portion of the wafer to the cooling plate, thereby enhancing cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the connection part has a perpendicular lateral surface, then the structure is simple, but the thermal paths from the outer circumferential portion to the cooling plate are insufficient
Solution Approach 1:
The connection part transitions from a two-dimensional perpendicular surface to a three-dimensional tapered surface, where the diameter increases from the wafer placement surface to the focus ring placement surface. This dimensional change creates additional thermal pathways radiating outward from the center, enabling heat to conduct from the outer circumferential portion of the wafer to the cooling plate through multiple angled paths rather than a single vertical path.
2Ease of operation
If the wafer outer circumferential portion is overhung, then the wafer can be placed on the surface, but the outer circumferential portion cannot be cooled sufficiently
Solution Approach 1:
The connection part is segmented into multiple thermal pathways radiating from the center to the outer circumference. The tapered surface creates distinct thermal conduction paths at different angles and positions, allowing heat from various regions of the wafer's outer circumferential portion to be conducted independently to the cooling plate, rather than relying on a single uniform cooling path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improved cooling capability of the outer circumferential portion of the wafer, preventing excessive heating and maintaining optimal temperature distribution across the wafer and focus ring.
Implementation Method 1
the wafer receives heat input from plasma, but the wafer is cooled by the cooling plate
Implementation Method 2
the wafer receives heat input from plasma
Data Source
AI summary
A member for semiconductor manufacturing apparatus includes a ceramic plate including a horizontal and circular wafer placement surface, and a horizontal and annular focus ring placement surface provided on an outer circumference of the wafer placement surface at a position lower than the wafer placement surface by one step, and a connection part that connects the wafer placement surface and the focus ring placement surface; and a cooling plate provided on a lower surface of the ceramic plate, wherein the connection part has a lateral surface of a circular truncated cone with a diameter that increases from the wafer placement surface to the focus ring placement surface, and the diameter of the upper surface of the circular truncated cone matches the outer diameter of the wafer placement surface, and the diameter of the lower surface of the circular truncated cone matches the inner diameter of the focus ring placement surface.