Wafer Edge Exposure Apparatus with Shared Worktable
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Solution Overview
Problem
Current wafer pre-alignment and edge exposure processes are complex, costly, and energy-consuming due to the use of separate devices with independent control systems, which are not efficient for handling various wafer types and require simultaneous control of multiple motion axes.
Innovation Solution
A compact edge exposure apparatus with a shared worktable for pre-alignment and edge exposure units, featuring a robotic arm, mechanical vision system, and exposure dose monitoring, allowing for precise centering, orienting, and adjustable exposure modes, including annular, segment-wise, and linear exposure, with real-time monitoring and online detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate devices with independent control systems are used for pre-alignment and edge exposure, then each function can be performed independently, but the device complexity increases, space occupation increases, and cost increases
Solution Approach 1:
The patent combines the pre-alignment unit and edge exposure unit into a single integrated apparatus that shares a common worktable and control system. This merging eliminates the need for separate independent devices while maintaining both functions, thereby reducing device complexity, space occupation, and cost without sacrificing functional reliability
Solution Approach 2:
The integrated apparatus is designed to perform multiple functions (pre-alignment and edge exposure) through a single system with a common worktable. The system can switch between different operational modes to accommodate various wafer types and exposure requirements, achieving multi-functionality that reduces overall system complexity while maintaining independent function performance
2Manufacturing precision
If simultaneous control of multiple motion axes including switching, rotation, lifting and centering axes is implemented, then precise positioning is achieved, but the control process becomes tedious and energy consumption increases
Solution Approach 1:
The system performs preliminary actions by pre-planning the sequence of motion axis operations and optimizing the control path before actual execution. This allows the multiple motion axes to be coordinated efficiently, reducing redundant movements and energy consumption while maintaining precise wafer positioning
Solution Approach 2:
The control system implements feedback mechanisms to monitor the positions of multiple motion axes in real-time and make adjustments as needed. This feedback control ensures precise positioning while optimizing energy consumption by avoiding unnecessary corrections and maintaining efficient operation throughout the positioning process
3Ease of manufacture
If chemical WEE method is used to remove photoresist, then photoresist removal is achieved, but the process cycle becomes long, cost increases due to expensive solvent, and pattern quality degrades
Solution Approach 1:
The patent replaces the chemical WEE method with a physical/optical approach using UV exposure lenses to expose the wafer edge directly. This substitution eliminates the need for chemical solvents and associated processing steps, thereby shortening the process cycle, reducing costs, and avoiding solvent contamination that would degrade pattern quality while maintaining effective photoresist removal capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-processing efficiency, supports various wafer sizes from 8 to 12 inches, and reduces costs by integrating pre-alignment and edge exposure functions, providing real-time exposure dose monitoring and adjustable exposure settings, thus enhancing automation and productivity.
Implementation Method 1
The light source is configured to emit light of a wavelength suitable for exposing photoresist
Implementation Method 2
a wafer is vacuum-absorbed onto a rotary table
Data Source
AI summary
An edge exposure apparatus and method are disclosed. The edge exposure apparatus includes: a base frame (1); an edge exposure unit (2) mounted on the base frame and configured to perform an edge exposure process on a wafer; a pre-alignment unit (3) for centering and orienting the wafer and cooperating with the edge exposure unit (2) in the edge exposure process; a cassette unit (4) for storing and detecting the wafer; a robotic arm (5) for transferring the wafer; and a master control unit (6) for controlling the above components of the edge exposure apparatus. The edge exposure unit (2) and the pre-alignment unit (3) share a common worktable, resulting in structural compactness. Alternatively, two pre-alignment units (3) and two edge exposure units (2) may be included in order to increase processing efficiency.