Wafer Edge Film Solidification for Variable Annular Thickness
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate processing apparatuses face challenges in efficiently forming annular films on semiconductor wafers with varying thicknesses, requiring multiple chemical liquids with different viscosities and repeated application and baking processes, which increases downtime, cost, and complexity.
Innovation Solution
The substrate processing apparatus includes a chemical liquid nozzle and a gas nozzle arranged downstream in the direction of substrate rotation, allowing for concurrent application and solidification of the chemical liquid, enabling efficient formation of films with varying thicknesses without the need for multiple chemical liquids or repeated processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple chemical liquids with different viscosities are used to form films with varying thicknesses, then film thickness control is improved, but device complexity and cost increase
Solution Approach 1:
The patent changes the physical state parameter of the chemical liquid from liquid to solid by controlling the temperature of the substrate. By cooling the substrate below the melting point of the chemical liquid, the liquid transforms into a solid film. This allows a single chemical liquid to form films of different thicknesses by varying application conditions and substrate temperature, eliminating the need for multiple chemical liquids with different viscosities.
Solution Approach 2:
The patent utilizes the phase transition of the chemical liquid from liquid to solid state. The chemical liquid is applied to the substrate in liquid form and then solidifies when the substrate temperature is below the melting point of the liquid. This phase transition mechanism enables precise control of film thickness and eliminates the complexity of managing multiple chemical liquids with different viscosities.
2Manufacturing precision
If repeated application and baking processes are used to achieve desired film thickness, then film thickness control is improved, but processing time and downtime increase
Solution Approach 1:
The patent employs phase transition from liquid to solid state to achieve film formation in a single step. The chemical liquid is applied to the substrate and immediately solidifies when the substrate temperature is below the melting point of the liquid. This eliminates the need for repeated application and baking cycles, significantly reducing processing time and downtime while maintaining precise film thickness control.
Solution Approach 2:
The patent prepares the substrate in advance by cooling it below the melting point of the chemical liquid before application. This preliminary cooling action ensures that the chemical liquid will immediately solidify upon contact with the substrate, enabling single-step film formation without requiring subsequent baking or repeated application cycles.
3Manufacturing precision
If multiple chemical liquids with different viscosities are loaded on the apparatus, then film thickness control is improved, but cost increases
Solution Approach 1:
The patent changes the controlling parameter from chemical liquid viscosity to substrate temperature. Instead of selecting different chemical liquids with different viscosities to achieve different film thicknesses, the system uses a single chemical liquid and controls the substrate temperature to manage the phase transition and film formation process. This significantly reduces manufacturing cost by eliminating the need to stock and manage multiple chemical liquids.
Solution Approach 2:
The patent makes a single chemical liquid universal for forming films of various thicknesses by controlling the substrate temperature and application conditions. The same chemical liquid can produce different film thicknesses depending on the substrate temperature relative to its melting point, eliminating the need for multiple specialized chemical liquids and reducing overall manufacturing cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for the efficient formation of films with varying thicknesses, reducing downtime, cost, and complexity, while improving the manufacturing efficiency of semiconductor devices by eliminating the need for multiple chemical liquids and repeated processes.
Implementation Method 1
a gas nozzle that is arranged on a downstream side in a direction of rotation of the substrate, away from a position where the chemical liquid is applied, and that solidifies the chemical liquid applied to the outer edge portion
Implementation Method 2
solidifies the chemical liquid applied to the outer edge portion, to form a solidified film
Data Source
AI summary
A substrate processing apparatus includes: a rotation support table capable of supporting and rotating a substrate; a chemical liquid nozzle that is arranged above an outer edge portion of the substrate that is supported by the rotation support table, and through which a chemical liquid is applied to the outer edge portion; and a solidified film forming unit that is arranged at least either on an upper side or on a lower side of the outer edge portion of the substrate that is supported by the rotation support table, and on a downstream side, in a direction of rotation of the substrate, of a position where the chemical liquid nozzle is arranged, and solidifies the chemical liquid applied to the outer edge portion, to form a solidified film that forms a part of an annular film.