Wafer Edge Cutting Fluid Control for Stable Annular Dicing
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Solution Overview
Problem
Conventional wafer cutting methods face instability and deteriorating processing quality due to cutting fluid entering under the lower surface of the wafer during annular cutting, especially when removing an annular area from the outer peripheral edge.
Innovation Solution
A cutting method and apparatus that adjusts the amount of cutting fluid supplied based on the position of the cutting blade relative to the wafer's outer peripheral edge, reducing fluid entry under the wafer by minimizing fluid supply when the blade overlaps the edge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If cutting fluid is supplied to the wafer during annular cutting to prevent adhesion and cool processing heat, then cutting performance is improved, but the cutting fluid enters under the lower surface of the wafer causing instability and deteriorating processing quality
Solution Approach 1:
The patent applies local quality by differentiating cutting fluid supply based on the cutting blade's position relative to the wafer's outer peripheral edge. When the blade overlaps the outer peripheral edge, cutting fluid supply is reduced or stopped to prevent fluid from entering under the wafer and causing instability. When the blade does not overlap the edge, normal cutting fluid supply is maintained to ensure effective cooling and chip removal. This spatially differentiated fluid supply strategy resolves the contradiction between maintaining cutting performance and ensuring wafer stability.
2Temperature
If cutting fluid is supplied during cutting of the outer peripheral edge to cool processing heat, then heat dissipation is improved, but the cutting fluid causes wafer instability
Solution Approach 1:
The patent implements local quality by controlling cutting fluid supply according to the specific cutting location. During cutting of the outer peripheral edge where the blade overlaps the edge, cutting fluid supply is restricted to prevent instability. During cutting of inner regions where the blade does not overlap the edge, full cutting fluid supply is provided for effective heat dissipation. This location-based differentiation resolves the contradiction between heat dissipation requirements and wafer stability.
3Object-generated harmful factors
If cutting fluid is supplied to prevent adhesion of cutting chips to the wafer, then chip removal is improved, but processing quality deteriorates due to fluid-induced instability
Solution Approach 1:
The patent applies local quality by varying cutting fluid supply based on blade position. When cutting the outer peripheral edge, fluid supply is reduced to prevent instability that would compromise processing quality. When cutting inner regions, full fluid supply is maintained to effectively prevent chip adhesion. This spatial differentiation resolves the contradiction between chip removal effectiveness and processing quality maintenance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Stabilizes the wafer during cutting, preventing fluid-induced instability and maintaining processing quality by controlling fluid flow based on blade position.
Implementation Method 1
a cutting fluid is supplied to the wafer in order to prevent adhesion of cutting chips to the wafer and to cool processing heat generated by cutting
Implementation Method 2
a cutting fluid is supplied to the wafer in order to prevent adhesion of cutting chips to the wafer
Data Source
AI summary
A wafer processing method is a method for annularly cutting a wafer along an outer periphery of the wafer with a cutting blade, and the method includes annularly cutting the wafer with the cutting blade along the outer periphery of the wafer while supplying a cutting fluid to the wafer, and cutting the wafer by changing a position of the cutting blade in a radial direction of the wafer, in which an amount of the cutting fluid supplied during cutting of a position where the cutting blade overlaps an outer peripheral edge of the wafer is set smaller than an amount of the cutting fluid supplied during cutting of a position where the cutting blade does not overlap the outer peripheral edge of the wafer.