In-situ Dressing for Semiconductor Wafer Edge Grinding
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Solution Overview
Problem
Existing edge grinding machines for semiconductor wafers require frequent maintenance to dress the grinding wheel, leading to increased downtime and reduced productivity.
Innovation Solution
An in-situ dressing station is integrated into the edge grinding machine, allowing the grinding wheel to be dressed periodically without removal, using a motor-driven dressing tool with a complementary forming shape to revitalize the dulled grinding rim surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the grinding wheel is removed for dressing, then the grinding rim surface can be revitalized, but maintenance downtime increases and productivity decreases
Solution Approach 1:
The patent merges the dressing function with the grinding machine by integrating a dressing tool and dressing station directly into the grinding system. This allows the grinding wheel to be dressed in-situ without removal, combining two previously separate operations (grinding and dressing) into one integrated system, thereby eliminating maintenance downtime while maintaining grinding wheel performance consistency
Solution Approach 2:
The dressing tool is positioned and ready to dress the grinding wheel proactively before performance degradation becomes critical. The system can dress the wheel periodically during operation based on predetermined criteria (number of wafers ground, time intervals, or performance metrics), preventing performance inconsistency before it occurs rather than reacting after degradation
2Manufacturing precision
If the grinding wheel is dressed frequently, then the rim surface remains optimal, but maintenance interruptions increase
Solution Approach 1:
The in-situ dressing capability enables continuous operation by eliminating the need to stop production for wheel dressing. The dressing tool can operate during periods when the grinding wheel is not actively grinding wafers, or the system can rapidly switch between grinding and dressing modes, maintaining continuous useful action without interruption to the overall manufacturing process
Solution Approach 2:
The grinding machine performs its own maintenance function by incorporating the dressing tool and station within the machine structure. The system is self-sufficient for wheel dressing, eliminating the need to transport wheels externally for dressing services. This self-service capability reduces maintenance complexity and time loss while maintaining precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces average downtime, extends the number of wafers that can be ground between maintenance interruptions, and improves the consistency and performance of the wafer edge beveling process over the life of each grinding wheel.
Implementation Method 1
The dressing tool can be used periodically after a programmable number of wafer grinds to revitalize the dulled grinding rim surface and expose fresh abrasive
Implementation Method 2
The dressing tool or wheel is mounted to be essentially co-planar with the rotational plane of the outer peripheral grinding rim surface of the grinding wheel
Data Source
AI summary
A grinding machine for edge grinding the peripheral wafer edge of a semiconductor wafer is configured for conducting an in situ dressing operation to refurbish or dress the peripheral grinding rim surface of a grinding wheel. The grinding machine includes at least one wafer-holding chuck, a grinding wheel, and a dressing tool that are linearly spaced apart and can be respectively moved relative to each other to selectively conduct the grinding and dressing operations. In one form plural grinding stations are disclosed.