Wafer Edge Separation Height Control for Stable Peripheral Trimming
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Solution Overview
Problem
Existing methods for edge trimming in semiconductor wafers face instability in the insertion position of removing members due to wafer bending or thickness non-uniformity, leading to improper removal of peripheral portions.
Innovation Solution
A substrate processing apparatus with a periphery removing apparatus that includes a holding member, a removing member, an elevating mechanism, and a controller to adjust the relative height position of the removing member, ensuring precise insertion and separation of the peripheral portion of the first substrate from the second substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a removing member is inserted between substrates to separate peripheral portions, then the peripheral portion can be removed, but the insertion position becomes unstable due to wafer bending or thickness non-uniformity
Solution Approach 1:
The removing member is configured to be movable in the thickness direction of the combined substrate, allowing dynamic adjustment of its position. The elevating mechanism enables the removing member to adapt to height variations caused by wafer bending or thickness non-uniformity, maintaining stable contact and separation force throughout the removal process.
Solution Approach 2:
The system changes the vertical position parameter of the removing member during operation. By adjusting the height of the removing member via the elevating mechanism, the system compensates for variations in substrate thickness and bending, ensuring consistent insertion depth and separation effectiveness across the entire peripheral portion.
2Device complexity
If the removing member position is fixed, then the device structure is simple, but improper removal occurs due to wafer thickness variations
Solution Approach 1:
The removing member transitions from a fixed position to a movable position in the thickness direction. This dynamic capability allows the system to accommodate wafer thickness variations without requiring complex multi-component adjustment mechanisms, achieving a balance between structural simplicity and trimming accuracy.
Solution Approach 2:
The elevating mechanism serves multiple functions: it positions the removing member for initial insertion, maintains contact pressure during separation, and compensates for thickness variations. This multi-functionality reduces the need for separate adjustment mechanisms, keeping the overall device structure relatively simple while improving edge trimming accuracy.
Data Source
AI summary
A substrate processing apparatus configured to process a combined substrate in which a first substrate and a second substrate are bonded to each other includes a holding member configured to hold the combined substrate; a removing member configured to separate at least a peripheral portion of the first substrate from the second substrate by being inserted between the first substrate and the second substrate; an elevating mechanism configured to adjust a relative height position of the removing member with respect to the holding member; and a controller configured to control an operation of the elevating mechanism. The controller controls the operation of the elevating mechanism such that the relative height position of the removing member with respect to a target insertion position of the removing member is adjusted in an entire circumference of the combined substrate.