Wafer Edge Image Inspection for Electroplating Leakage Warnings
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Solution Overview
Problem
Existing manual inspection methods for detecting leakage plating in semiconductor manufacturing are inefficient, costly, and prone to errors, leading to reworking or scrapping of entire wafer batches.
Innovation Solution
An automated warning method and system using an image sensor to detect unwanted metal deposition on a predefined target area of the wafer, issuing alarms for leakage plating, and switching the electroplating chamber state to maintenance mode.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If manual inspection is used to detect leakage plating after entire batch electroplating, then inspection cost and time are reduced, but detection precision and reliability deteriorate leading to rework or scrapping
Solution Approach 1:
The patent replaces manual mechanical inspection with an automated optical detection system using a sensor to capture images of the wafer edge target area. This substitution enables continuous, high-precision detection without human intervention, resolving the contradiction between inspection speed and detection accuracy by achieving both simultaneously through automation.
Solution Approach 2:
The patent creates an optical copy (image) of the wafer's target area using an image sensor, then analyzes this copy to detect unwanted metal deposition. This copying approach allows detailed examination of the detection area without physically contacting or damaging the actual wafer, enabling high-precision detection while maintaining production flow.
2Device complexity
If manual inspection is performed after entire batch electroplating, then device complexity is reduced, but productivity deteriorates due to batch rework or scrapping
Solution Approach 1:
The patent performs detection during or immediately after the electroplating process itself, rather than waiting for batch completion. By detecting leakage plating in real-time or near-real-time, the system enables immediate chamber shutdown, preventing contamination of subsequent wafers and maintaining high productivity without requiring complex post-processing inspection systems.
Solution Approach 2:
The electroplating chamber system performs its own self-inspection through the integrated detection system that monitors for leakage plating during the plating process. This self-service capability eliminates the need for separate, complex external inspection equipment while maintaining high productivity through continuous monitoring and immediate anomaly response.
3Measurement precision
If manual inspection is used, then measurement precision might be adequate, but reliability deteriorates due to human errors causing misjudgments and missed judgments
Solution Approach 1:
The patent implements a closed-loop feedback system where the sensor continuously monitors the wafer target area, the processor analyzes the captured images, and the system provides immediate feedback by triggering an alarm or shutdown when leakage plating is detected. This automated feedback mechanism eliminates human error and subjectivity, ensuring consistent, reliable detection decisions based on objective image analysis criteria.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Automatically detects leakage plating issues promptly, reducing waste and improving processing efficiency by preventing further wafer processing in faulty chambers.
Implementation Method 1
operating an image sensor to detect the target detection area of the wafer
Implementation Method 2
the processor receives the target image, performs grayscale processing on the target image, generates gray value data information of the target image
Data Source
AI summary
An electroplating chamber leakage plating warning method and system are disclosed. The method includes: positioning the electroplated wafer (100) at a detection location (S100); setting a target detection area (S200) of the wafer (100); operating an image sensor (400) to detect the target detection area (S300) of the wafer (100), and determining whether there is unwanted metal deposition in the target detection area of the wafer (100) (S400); if the determination result indicates the presence of unwanted metal deposition in the target detection area of the wafer (100), indicating a leakage plating occurrence in the electroplating chamber processing the wafer (100), then an alarm command is issued; if the determination result indicates that there is no unwanted metal deposition in the target detection area of the wafer (100), indicating no leakage plating occurrence in the electroplating chamber processing the wafer (100), then no alarm command is issued. By using a detection device to automatically perform leakage plating detection on the wafer (100), it can replace manual inspection of the electroplating conditions of the wafer (100), promptly detect leakage plating issues on the wafer (100), and issue an alarm, facilitating the handling of the electroplating chamber by the staff.