Wafer Edge Analysis with Liquid Catch Plate and Scanning Nozzle
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Solution Overview
Problem
Existing methods for analyzing the edge and bevel parts of semiconductor wafers are cumbersome, require specialized equipment, and struggle with residual contamination and accuracy due to complex cleaning processes, especially when analyzing both the top and back flat faces simultaneously.
Innovation Solution
A substrate analysis method using a nozzle with a triple concentric tube structure that discharges and sucks analysis liquid, combined with a hydrophobic liquid catch plate to retain the liquid between the nozzle tip and the catch plate, allowing for simultaneous scanning and analysis of the substrate's edge and bevel parts with easy cleaning and high accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If existing methods are used to analyze the edge and bevel parts of semiconductor wafers, then analysis can be performed, but the process becomes cumbersome and requires specialized equipment with complex cleaning procedures
Solution Approach 1:
The patent combines the liquid discharge function and liquid collection function into a single nozzle structure. The nozzle includes a liquid discharge portion that discharges analysis liquid and a liquid collection portion that collects the liquid after it contacts the substrate edge and bevel parts. This integration eliminates the need for separate specialized equipment and simplifies the overall system while maintaining analysis capability.
Solution Approach 2:
The nozzle is designed with multi-functionality, serving both to discharge analysis liquid onto the substrate and to collect the liquid after it has contacted the edge and bevel parts. This universal design allows a single component to perform multiple operations that previously required separate specialized devices, reducing equipment complexity and streamlining the analysis process.
2Measurement precision
If complex cleaning processes are used to remove residual contamination, then analysis accuracy can be maintained, but the process becomes more cumbersome and time-consuming
Solution Approach 1:
The patent extracts the collected analysis liquid containing contaminants from the nozzle system through a dedicated liquid collection portion. By separating the contaminated liquid from the analysis system and directing it to waste or separate processing, residual contamination is eliminated without requiring complex cleaning procedures of the entire system, thus maintaining accuracy while reducing cleaning time.
Solution Approach 2:
The analysis liquid after contacting the substrate edge and bevel parts is collected and discarded or separately processed rather than being reused or requiring the system to be cleaned extensively. This approach eliminates residual contamination effectively while minimizing the time and complexity of cleaning operations, as the contaminated liquid is simply removed from the system.
3Reliability
If the nozzle discharges analysis liquid without a retention structure, then the structure remains simple, but the liquid cannot be retained between the nozzle tip and catch plate for proper analysis
Solution Approach 1:
The nozzle structure merges the liquid discharge function and liquid collection function into a single integrated component. The liquid collection portion is positioned to receive liquid that flows from the discharge portion after contacting the substrate, creating an inherent retention mechanism without requiring additional separate structures. This integration provides reliable liquid retention while maintaining relative structural simplicity.
4Measurement precision
If conventional analysis methods are used for substrate edges, then analysis can be performed, but residual contamination remains an issue affecting accuracy
Solution Approach 1:
The patent extracts the contaminated analysis liquid from the nozzle system through the liquid collection portion, which is positioned to receive and separate the liquid after it has contacted the substrate edge and bevel parts. By removing the contaminated liquid from the system, residual contamination is eliminated, preventing it from affecting subsequent analyses and maintaining high measurement precision.
Solution Approach 2:
The analysis liquid containing contaminants from the substrate edge and bevel parts is collected and discarded or separately processed rather than being retained or reused in the analysis system. This approach effectively eliminates residual contamination by removing it from the system, ensuring that subsequent analyses are not affected by previous contaminants while maintaining analysis accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables speedy and accurate analysis of the edge and bevel parts of semiconductor wafers by simplifying the process, reducing labor and equipment complexity, and minimizing residual contamination through concurrent movement of the nozzle and catch plate with ultrapure water washing.
Implementation Method 1
a hydrophobic liquid catch plate to retain the liquid between the nozzle tip and the catch plate
Implementation Method 2
retain the liquid between the nozzle tip and the catch plate
Data Source
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AI summary
The present invention provides an analytical technique that enables simpler and speedier analysis of an end part of a substrate. Also provided is an analysis method of a substrate by use of a nozzle for substrate analysis which discharges an analysis liquid from a tip, scans a substrate surface with a discharged analysis liquid, and then sucks the analysis liquid, including the steps of: arranging, opposite to a nozzle tip, a liquid catch plate that catches the discharged analysis liquid, to thereby retain the analysis liquid discharged from the tip between the nozzle tip and the liquid catch plate; positioning the substrate so that the end part thereof can be inserted between the nozzle tip and the liquid catch plate; bringing the end part of the substrate into contact with the analysis liquid retained between the nozzle tip and the liquid catch plate; and moving the nozzle and the liquid catch plate concurrently along a periphery of the substrate, while keeping the end part of the substrate in contact with the analysis liquid, to thereby analyze an end part of the substrate.