Wafer Edge Liquid Treatment Ring Guide
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing devices for liquid treatment of defined areas on wafers face challenges in effectively treating the edge regions, especially when the wafer surface is hydrophobic and the treatment liquid is hydrophilic, and in treating small edge areas where conventional masks fail to contain the liquid.
Innovation Solution
A device featuring a ring-shaped liquid guiding member with a lip projecting from the plane of symmetry between the wafer's surface planes, which collects and directs the treatment liquid to the edge and peripheral regions, allowing for efficient wetting and treatment, even with non-wetting liquids, and includes a rotatable support and gas supply to prevent liquid from reaching untreated areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a mask is kept at a defined short distance to the wafer-shaped article to retain liquid by capillary forces, then liquid can be contained in the defined area, but liquid cannot properly wet hydrophobic surfaces and may wrap around the wafer edge uncontrollably
Solution Approach 1:
The patent introduces a liquid guiding member as an intermediary component between the liquid source and the wafer surface. This member actively guides the liquid flow along the wafer edge, preventing uncontrolled wrapping while ensuring proper liquid distribution in the target area, thus resolving the contradiction between liquid containment and control reliability
Solution Approach 2:
The patent replaces the passive capillary force-based mask system with an active liquid guiding mechanism. Instead of relying on capillary forces alone to contain liquid, the system uses a mechanically controlled guiding member that can be positioned and adjusted to precisely control liquid flow paths, eliminating the wrapping problem while maintaining containment
2Adaptability or versatility
If the wafer surface is hydrophobic and treatment liquid is hydrophilic, then liquid dispensing is problematic, but treatment of small edge areas (e.g., 0.3 mm from edge) becomes impossible with conventional masks
Solution Approach 1:
The patent replaces the passive mask system with an active liquid guiding member that mechanically directs liquid flow. This allows precise control of liquid paths to reach small edge areas (0.3 mm from edge) without relying on capillary forces, making treatment of hydrophobic surfaces and small areas equally feasible
Solution Approach 2:
The liquid guiding member enables different liquid flow characteristics in different regions: in the target edge area, liquid is precisely delivered for treatment, while in other areas liquid flow is controlled to prevent unwanted wetting. This local control of liquid quality resolves the contradiction between treating small areas and maintaining liquid control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective liquid treatment of wafer edges and peripheral regions, including small areas, by ensuring the liquid wraps around the edge and is contained, improving treatment efficiency and preventing unwanted liquid contact with untreated surfaces.
Implementation Method 1
a gas supply for purging a surface of the wafer-shaped article, which faces the support and is not to be treated with the liquid
Implementation Method 2
said ring has a lip that projects from the plane of symmetry M between the first surface plane and the second surface plane of the wafer-shaped article with respect to the support
Implementation Method 3
a support for holding the wafer-shaped article, on which the wafer-shaped article can be rotated
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Method and device for wet treating a defined peripheral edge-region of a wafer-shaped article having a first surface plane W1, a second surface plane W2 and an edge surface. The device comprises a support for holding the wafer-shaped article; liquid dispensing means for dispensing liquid onto said first surface plane W1 of the wafer-shaped article not facing the support and liquid guiding member connected to the support for guiding at least a part of said liquid around the edge surface of the wafer-shaped article towards the second surface plane W2 of the wafer-shaped article facing the support thereby wetting at least the edge surface, wherein said liquid guiding member has the form of a ring.