Wafer Edge Micro-Chamber Structure for Precise Outer Edge Etching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor processing devices are inefficient in performing targeted processing on the outer edge of semiconductor wafers without affecting other parts, as they require costly and complex dry processes.
Innovation Solution
A semiconductor processing device with a movable chamber system that forms a closed outer edge micro-processing space using channels and processing holes, allowing for targeted fluid flow and processing on the outer edge of the wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dry process with plasma generator is used for targeted etching on the outer edge of semiconductor wafers, then the processing precision is improved, but the device complexity and cost increase
Solution Approach 1:
The processing chamber is divided into distinct regions: a micro chamber for holding the semiconductor wafer and an outer edge processing space for targeted treatment. This segmentation allows the processing system to focus only on the outer edge region, achieving precise targeted etching without requiring complex plasma generator systems that would be needed for whole-wafer processing.
Solution Approach 2:
The patent applies local quality by creating a specialized processing environment only where needed - the outer edge processing space is equipped with fluid delivery systems and sealed configurations specifically for edge treatment, while the rest of the chamber maintains a simpler structure suitable for wafer loading and general processing.
2Manufacturing precision
If a dry process with plasma generator is used for targeted etching on the outer edge of semiconductor wafers, then the processing precision is improved, but the cost increases
Solution Approach 1:
By segmenting the processing chamber into a micro chamber and an outer edge processing space, the system achieves targeted edge etching using simpler, more cost-effective fluid-based processing equipment rather than expensive plasma generation systems, thereby reducing overall device cost while maintaining processing precision.
Solution Approach 2:
The patent employs disposable or easily replaceable sealing elements (such as O-rings or gaskets) in the outer edge processing space, allowing for simple, low-cost maintenance and replacement rather than investing in complex, expensive plasma generator systems that would require sophisticated maintenance infrastructure.
3Productivity
If a micro chamber processing device is used for overall processing of semiconductor wafers, then the processing efficiency is improved, but the ability to perform targeted edge processing is lost
Solution Approach 1:
The processing device is segmented into a micro chamber for efficient wafer handling and an integrated outer edge processing space for targeted treatment. This segmentation allows the device to maintain high processing efficiency through automated wafer loading while simultaneously gaining the adaptability to perform specialized edge processing operations.
Solution Approach 2:
The processing device is designed with multi-functionality by incorporating both overall wafer processing capabilities (through the micro chamber) and targeted outer edge processing capabilities (through the integrated processing space with sealing mechanisms), allowing a single device to perform multiple processing functions without requiring separate specialized equipment.
4Device complexity
If fluid is used for outer edge processing instead of dry process, then the device complexity is reduced, but the processing precision may be affected
Solution Approach 1:
The patent implements local quality by creating a tightly controlled, sealed outer edge processing space that concentrates the processing fluid precisely where needed. This localized fluid delivery system, equipped with sealing mechanisms, ensures that the simpler fluid-based process achieves the same level of precision as complex dry processes by eliminating fluid dispersion and maintaining focused action on the outer edge.
Solution Approach 2:
The patent introduces sealing elements (O-rings, gaskets, or deformable sealing portions) as intermediaries between the processing fluid and the outer edge region. These intermediaries ensure precise fluid containment and directed delivery, allowing the simple fluid-based process to achieve high precision by mediating the interaction between the fluid and the semiconductor wafer edge.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient, cost-effective, and simple targeted processing of the outer edge of semiconductor wafers with reduced fluid consumption and lower operational complexity compared to traditional dry processes.
Implementation Method 1
a first channel and a second channel are respectively formed on internal surfaces of the first and second chamber portions facing the micro chamber... the first channel and the second channel are connected and together form an outer edge micro-processing space
Implementation Method 2
the thin layer on the outer edge of the semiconductor wafer needs to be etched and removed without destroying the thin layers of other parts
Data Source
Figure 1a~1d
Figure 2a~2b
Figure 2c
AI summary
A semiconductor processing device, comprising: a first chamber; a second chamber movable with respect to the first chamber portion between an open position and a closed position, a micro-chamber being formed between the first chamber portion and the second chamber portion when the second chamber portion is in the closed position with respect to the first chamber portion. The first chamber portion has a first channel formed on an inner wall surface of the first chamber portion facing the micro-chamber. The second chamber portion has a second channel formed on an inner wall surface of the second chamber portion facing the micro-chamber. When the second chamber portion is in the closed position with respect to the first chamber portion and a semiconductor wafer is accommodated in the micro-chamber, the first channel and the second channel communicate with each other and form an edge micro-processing space together, such that the outer edge of the semiconductor wafer accommodated in the micro-chamber extends into the edge micro-processing space. The edge micro-processing space is able to realize processing of the outer edge of the semiconductor wafer.