Wafer Edge Micro-Chamber for Targeted Semiconductor Processing
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Solution Overview
Problem
Existing semiconductor processing devices are unsuitable for targeted processing of the outer edge of semiconductor wafers, as they expose the entire wafer to processing fluids, leading to costly and complex dry processes.
Innovation Solution
A semiconductor processing device with movable chamber portions forming a micro chamber that creates a sealed edge micro-processing space using channels and through-holes for targeted processing of the outer edge, allowing fluids to enter and exit through specific openings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dry process with plasma generator is used for targeted etching of the outer edge, then the etching precision is improved, but the device complexity and cost increase
Solution Approach 1:
The processing space is segmented into a sealed edge micro-processing space that isolates only the outer edge region from the main processing fluid flow. This segmentation allows targeted processing of the edge area without requiring complex plasma generation equipment, as the simplified sealed space can be effectively controlled with basic fluid injection and suction mechanisms.
Solution Approach 2:
The outer edge region is extracted and isolated from the rest of the wafer surface by creating a separate sealed micro-processing space. This extracted region can be processed independently using simple fluid control, eliminating the need for complex plasma generators while maintaining precise edge processing capability.
2Area of stationary object
If the entire wafer is exposed to processing fluid in a micro chamber, then the processing coverage is improved, but the adaptability for targeted processing deteriorates
Solution Approach 1:
The processing system is divided into two functional parts: a sealed edge micro-processing space for targeted edge processing and a main processing fluid flow path for overall wafer processing. This segmentation allows the same device to perform both comprehensive coverage processing and targeted edge processing by controlling the sealing mechanism and fluid flow.
Solution Approach 2:
The processing configuration is made dynamic through the movable sealing member that can adjust between different positions. When the sealing member is in the first position, it creates a sealed edge micro-processing space for targeted edge processing. When adjusted to the second position, it allows full wafer exposure for comprehensive processing, providing versatility through dynamic reconfiguration.
3Adaptability or versatility
If a sealed edge micro-processing space is created with movable sealing member, then the targeted processing capability is improved, but the device complexity increases
Solution Approach 1:
A flexible sealing member is used to create the sealed edge micro-processing space. This flexible component can be moved between different positions to either seal the edge region for targeted processing or open it for comprehensive processing, providing adaptability without requiring complex mechanical structures.
Solution Approach 2:
The movable sealing member serves multiple functions: it seals the edge micro-processing space when in the first position for targeted edge processing, and it allows full wafer exposure when in the second position for comprehensive processing. This single component provides both targeted and comprehensive processing capabilities, reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves targeted processing of the outer edge with reduced fluid consumption, simpler structure, and lower operational complexity compared to dry processes, while maintaining precision and efficiency.
Implementation Method 1
a first channel and a second channel are respectively formed on internal surfaces of the first and second chamber portions facing the micro chamber... the first channel and the second channel are connected and together form an edge micro-processing space... fluid flows in or out of the edge micro processing space through the edge processing through-hole
Data Source
AI summary
A semiconductor processing device, comprising: a first chamber; a second chamber movable with respect to the first chamber portion between an open position and a closed position, a micro-chamber being formed between the first chamber portion and the second chamber portion when the second chamber portion is in the closed position with respect to the first chamber portion. The first chamber portion has a first channel formed on an inner wall surface of the first chamber portion facing the micro-chamber. The second chamber portion has a second channel formed on an inner wall surface of the second chamber portion facing the micro-chamber. When the second chamber portion is in the closed position with respect to the first chamber portion and a semiconductor wafer is accommodated in the micro-chamber, the first channel and the second channel communicate with each other and form an edge micro-processing space together, such that the outer edge of the semiconductor wafer accommodated in the micro-chamber extends into the edge micro-processing space. The edge micro-processing space is able to realize processing of the outer edge of the semiconductor wafer.