Wafer Edge Micro-Chamber Processing for Targeted Outer-Edge Etching
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Solution Overview
Problem
Existing semiconductor processing devices are inadequate for targeted processing of the outer edge of semiconductor wafers, as they typically require costly and complex dry processes, and existing micro-chamber devices are unsuitable for edge-specific processing without affecting other parts of the wafer.
Innovation Solution
A semiconductor processing device with a first and second chamber portion that forms a micro-chamber, featuring channels and channels on the chamber surfaces to create an edge micro-processing space for targeted fluid flow, allowing precise processing of the outer edge of semiconductor wafers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dry process with plasma generator is used for targeted etching on the outer edge, then the thin layer on the outer edge can be removed, but the process becomes costly and complicated
Solution Approach 1:
The device divides the processing space into a micro chamber for the entire wafer and an edge processing space for the outer edge, allowing separate processing zones. This segmentation enables targeted edge processing using simple fluid flow without requiring complex plasma generators, thus reducing device complexity while maintaining manufacturing precision
Solution Approach 2:
The patent creates a localized edge processing space with channels that direct processing fluid specifically to the outer edge region. This local quality approach allows different processing conditions (fluid-based etching) to be applied to the edge region without affecting the entire wafer, achieving targeted precision with simple equipment
2Manufacturing precision
If a dry process with plasma generator is used for targeted etching on the outer edge, then the thin layer on the outer edge can be removed, but the process becomes costly
Solution Approach 1:
The patent replaces expensive plasma generation equipment with simple fluid delivery channels and processing fluid. The processing fluid acts as a consumable, low-cost medium that can be easily replaced, eliminating the need for costly plasma generators while achieving the same targeted etching function
Solution Approach 2:
The invention uses hydraulic principles by directing processing fluid through channels to the edge processing space. This fluid-based approach replaces expensive plasma technology with simple pump and channel systems, significantly reducing manufacturing costs while maintaining targeted processing capability
3Productivity
If processing fluid flows through the micro chamber, then the semiconductor wafer can be processed, but the processing fluid consumption is high
Solution Approach 1:
The device segments the processing system into a micro chamber for wafer accommodation and a separate edge processing space for fluid delivery. This segmentation confines the processing fluid to only the edge processing space, preventing fluid from filling the entire micro chamber and thus reducing fluid consumption while maintaining processing efficiency
Solution Approach 2:
The patent applies processing fluid locally to the edge processing space rather than filling the entire micro chamber. The channels deliver fluid precisely where needed (at the outer edge), creating a localized processing zone that minimizes fluid usage while maintaining high processing efficiency at the target area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient, cost-effective, and simple processing of the outer edge of semiconductor wafers with reduced fluid consumption, while maintaining a low operational skill requirement and minimizing impact on other wafer areas.
Implementation Method 1
the first channel and the second channel are connected and together form an edge micro-processing space, which accommodates the outer edge of the semiconductor wafer in the micro chamber into the edge micro-processing space, which is communicated with the outside through the edge processing through-hole, the fluid flows in or out of the edge micro processing space through the edge processing through-hole
Data Source
AI summary
A semiconductor processing device, comprising: a first chamber; a second chamber movable with respect to the first chamber portion between an open position and a closed position, a micro-chamber being formed between the first chamber portion and the second chamber portion when the second chamber portion is in the closed position with respect to the first chamber portion. The first chamber portion has a first channel formed on an inner wall surface of the first chamber portion facing the micro-chamber. The second chamber portion has a second channel formed on an inner wall surface of the second chamber portion facing the micro-chamber. When the second chamber portion is in the closed position with respect to the first chamber portion and a semiconductor wafer is accommodated in the micro-chamber, the first channel and the second channel communicate with each other and form an edge micro-processing space together, such that the outer edge of the semiconductor wafer accommodated in the micro-chamber extends into the edge micro-processing space. The edge micro-processing space is able to realize processing of the outer edge of the semiconductor wafer.