Wafer Edge Coating Nozzle Speed Control to Suppress Splashing
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Solution Overview
Problem
Conventional coating treatment methods for semiconductor wafers face challenges in accurately forming a protective film on the peripheral portions while preventing the coating solution from splashing and adhering to the inner surface edges of the cup and block body during the etching process.
Innovation Solution
A coating treatment apparatus with a controller that controls the movement of a nozzle at different speeds to apply the coating solution to the peripheral portion of the substrate, moving from outside to inside at a first speed and then from inside to outside at a higher second speed, thereby reducing splashing and adhesion to the cup's inner surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the coating solution supply nozzle moves at a constant speed from outside to inside the substrate perimeter, then the coating solution is supplied uniformly, but the coating solution splashes and adheres to the inner surface edges of the cup and block body
Solution Approach 1:
The patent applies dynamics by varying the moving speed of the coating solution supply nozzle during the coating process. The nozzle moves at a first speed when approaching the substrate perimeter and at a second speed (higher than the first speed) when retracting from the substrate perimeter. This dynamic speed adjustment prevents the coating solution from splashing and adhering to the cup and block body while maintaining accurate coating film formation on the substrate peripheral portion.
2Object-generated harmful factors
If the nozzle moves quickly from inside to outside the substrate perimeter, then the coating solution splashing is reduced, but the coating film formation accuracy may be compromised
Solution Approach 1:
The patent resolves this contradiction by implementing dynamic speed control at different stages of the nozzle movement. When moving from inside to outside the substrate perimeter (retraction phase), the nozzle moves at a higher second speed to minimize splashing. When moving from outside to inside (coating phase), the nozzle moves at a controlled first speed to ensure accurate coating film formation. This staged dynamic speed adjustment optimizes both coating precision and splash prevention.
Data Source
AI summary
A coating treatment apparatus for applying a coating solution to a peripheral portion of a substrate, includes: a holding and rotating part holding and rotating the substrate; a coating solution supply nozzle supplying the coating solution to the peripheral portion of the substrate; a moving mechanism moving the coating solution supply nozzle; and a controller controlling the holding and rotating part, coating solution supply nozzle, and moving mechanism, wherein the controller performs control of, while rotating the holding and rotating part: by controlling the moving mechanism while supplying the coating solution by the coating solution supply nozzle, both moving the coating solution supply nozzle from an outside of a perimeter of the substrate to a predetermined position at a periphery on the substrate at a first speed and then moving the coating solution supply nozzle from the predetermined position to the outside of the perimeter at a higher second speed.