Semiconductor Wafer Reinforcement Edge Removal Device
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Solution Overview
Problem
Existing methods for removing an annular reinforcing edge from a semiconductor wafer during grinding processes risk damaging the active wafer surface due to vibrations or unintended detachment of semiconductor structures, especially when the wafer thickness is reduced below 150 µm.
Innovation Solution
A device with a clamping device and support that stretches the carrier film between the clamping device and the reinforcing edge, using a tensioning device and tool guide to apply a shearing load and facilitate mechanical detachment without vibrations, utilizing a non-cutting dividing tool and UV radiation to weaken the adhesive connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an impulse is applied to the carrier film to weaken the adhesive bond, then the reinforcing edge can be pulled off, but vibrations occur in the active wafer surface causing damage risk
Solution Approach 1:
The separating device uses a dividing tool that moves between the reinforcing edge and carrier film to create a separation interface, segmenting the detachment process into controlled zones rather than applying impulse to the entire carrier film at once
Solution Approach 2:
A dividing tool acts as an intermediary element between the separating device and the carrier film-reinforcing edge system, mechanically inserting itself to create a separation interface and guide the detachment process without transmitting harmful vibrations to the wafer
2Reliability
If UV light is irradiated to soften the carrier film material connection, then adhesive forces are reduced, but surrounding areas including active wafer area are also softened causing unintended detachment
Solution Approach 1:
The separating device applies separation force locally at the interface between the reinforcing edge and carrier film using a dividing tool, rather than softening the entire carrier film area with UV light, thus achieving adhesive reduction only where needed
Solution Approach 2:
The patent replaces the UV radiation method with a mechanical separating device that uses a dividing tool to physically insert and separate the reinforcing edge from the carrier film through controlled mechanical action
3Object-affected harmful factors
If the carrier film is stretched to create shearing load for detachment, then adhesive connection is weakened without vibration, but increased edge stress peaks form requiring even distribution
Solution Approach 1:
The clamping device is designed to clamp the carrier film at an offset position relative to the reinforcing edge, creating asymmetric stress distribution that generates beneficial shearing loads at the adhesive interface while the even distribution around the support compensates for stress concentration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the safe removal of the reinforcing edge in one piece with minimal vibration, preventing damage to semiconductor structures and maintaining structural simplicity in the device design.
Implementation Method 1
a holding device (7) which has a support (8) with suction openings (9) for holding the semiconductor wafer
Implementation Method 2
the clamping device interacting with the support to produce a stretching of the carrier film between the clamping device and the reinforcing edge
Implementation Method 3
the carrier film, which is stretched as a result of the cooperation between the tensioning device and the support, causes a shearing load in the adhesive connection
Implementation Method 4
the carrier film of the wafer frame is irradiated with UV light from below in order to reduce adhesive forces or to soften the material connection
Data Source
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AI summary
What is disclosed is an apparatus (1) for removing a ring-shaped reinforcement edge (2) from a ground semiconductor wafer (3), which is cohesively connected to an elastic carrier film (4) and is fixed to a circumferential wafer frame (11) via said carrier film (4), comprising a holding device (7), which has a support (8) having suction openings (9) for holding the semiconductor wafer (3) on the support surface (16) of the support (8), and comprising a separating device (6), which comprises means for integrally detaching the reinforcement edge (2) from the carrier film (4). In order to be able to detach the reinforcement edge from the carrier film (4) without damage, it is proposed that the holder device (7) has a clamping device (10) encompassing the support (8) and serving for clamping the wafer frame (11) and/or the carrier film (4), wherein the clamping device (10) interacts with the support (8) to stretch the carrier film (4), and that the separating device (6) has a tool guide (13) with a dividing tool (12) for moving the dividing tool (12) between carrier film (4) and reinforcement edge (2) in order to detach the reinforcement edge (2) in one piece from the carrier film (4) stretched by interaction of clamping device (10) and support (8).