Movable Wafer Edge Ring Assembly for Plasma Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in advanced semiconductor manufacturing is achieving uniformity of critical dimensions and thickness at the edge of a wafer due to non-uniform plasma distribution, which affects die yield and availability.
Innovation Solution
A device with a movable ring assembly and heating elements that adjust gaps and temperatures to control plasma distribution and etching uniformity at the wafer's peripheral region, using a ring assembly with movable segments and heating elements to adjust plasma and temperature distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the wafer diameter is increased to form more dies at the edge, then die availability increases, but process condition uniformity at the edge deteriorates
Solution Approach 1:
The ring assembly is divided into multiple independently controllable ring segments that can be adjusted to provide localized process conditions at different radial positions on the wafer. This allows different edge regions to receive tailored plasma and temperature conditions, improving uniformity across the expanded wafer area while maintaining high die availability.
Solution Approach 2:
The ring segments are made movable and adjustable during the semiconductor processing operation. The gap between ring segments and wafer edge can be dynamically modified to control plasma distribution and temperature uniformity at the wafer edge, enabling adaptation to different wafer sizes and processing requirements.
2Manufacturing precision
If the gap between the ring assembly and wafer edge is reduced to improve plasma distribution, then etching uniformity improves, but the risk of physical contact and contamination increases
Solution Approach 1:
The ring assembly incorporates movable ring segments with adjustable gaps that can be dynamically positioned during processing. The gap distance can be optimized to achieve uniform plasma distribution and etching while maintaining sufficient clearance to prevent physical contact and contamination, resolving the trade-off between uniformity and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves critical dimension uniformity and die yield by controlling plasma distribution and temperature uniformly across the wafer's edge, enhancing the processing quality of semiconductor devices.
Implementation Method 1
a treatment is performed on the substrate after the real-time temperature of each of the heating areas is equal to the target temperature determined in step 92 or adjusted in step 97
Implementation Method 2
In some embodiments, the treatment is performed by dry etching
Data Source
AI summary
A device includes a substrate retainer for retaining a substrate thereon, and a ring assembly including an upper ring which has a plurality of upper ring segments that are angularly displaced from each other. Each of the upper ring segments is movable between an inner position and an outer position so as to adjust a gap between an outer periphery of the substrate and an inner edge of each of the upper ring segments when the substrate is retained on the substrate retainer.