Wafer Edge Ring Positioning Using Dual Pins and Circumference Detection
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Solution Overview
Problem
Existing substrate positioning systems face challenges in accurately positioning semiconductor wafers and edge rings, particularly in detecting and correcting deviations in their centers and circumferential positions during rotation and transfer processes.
Innovation Solution
The system employs a stage with a first pin and a second pin to hold the edge ring, a rotation mechanism to rotate the stage and pins, and an elevating mechanism to adjust the pins, along with a detection mechanism to accurately position the substrate and edge ring by detecting their outer and inner circumferences, respectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single pin is used to hold the edge ring, then the device structure is simple, but the positioning precision of the edge ring and substrate is insufficient
Solution Approach 1:
The edge ring holding function is segmented into two separate pins (first pin and second pin) instead of using a single pin. This segmentation allows independent positioning and adjustment of each pin, enabling more precise control of the edge ring position and improving overall positioning precision while maintaining reasonable device complexity
Solution Approach 2:
The edge ring acts as an intermediary component between the two pins and the substrate. By precisely positioning the edge ring using the two pins, the system achieves better substrate positioning accuracy. The edge ring serves as a mediator that transfers the positioning precision from the pin assembly to the substrate placement
2Measurement precision
If the detection mechanism detects only the substrate position, then the detection system is simple, but the positioning accuracy of both substrate and edge ring cannot be ensured
Solution Approach 1:
The detection mechanism is designed with multi-functionality to detect both the substrate outer circumference and the edge ring inner circumference using the same detection system. This universal detection approach enables simultaneous monitoring of both components' positions, ensuring accurate positioning for both the substrate and edge ring without requiring separate detection systems
Solution Approach 2:
The detection mechanism provides feedback on the positions of both the substrate and edge ring. By detecting the outer circumference of the substrate and the inner circumference of the edge ring, the system obtains real-time position information that can be used to adjust and maintain precise positioning, ensuring measurement accuracy for both components
3Adaptability or versatility
If the pins are fixed in position, then the mechanism structure is simple, but the adaptability to different edge ring sizes and positions is limited
Solution Approach 1:
The pins are designed with dynamic positioning capabilities through the elevating mechanism, allowing them to move vertically and adjust their positions. This dynamic adjustment enables the pins to accommodate different edge ring sizes and positions, providing versatility in handling various edge ring configurations while maintaining a relatively simple mechanism structure
Solution Approach 2:
The elevating mechanism changes the positional parameters of the pins by adjusting their vertical positions. This parameter adjustment allows the pins to adapt to different edge ring dimensions and locations, enhancing the system's versatility. The ability to modify pin positions through controlled elevation provides flexibility without significantly increasing device complexity
Data Source
AI summary
A positioning apparatus includes a stage configured to hold a substrate, a first pin configured to hold an edge ring and a second pin separately provided from the first pin and configured to hold the edge ring. The positioning apparatus further includes a rotation mechanism configured to rotate the stage and the first pin, an elevating mechanism configured to raise and lower at least one of the first pin and the second pin and a detection mechanism configured to detect a position of an outer circumference of the substrate held by the stage and a position of an inner circumference of the edge ring held by the first pin.