Wafer Edge Spray Scanning to Prevent Cleaning Contamination
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Solution Overview
Problem
In batch-type wafer cleaning devices, foreign matter can be transferred from the outer periphery of wafers to their surfaces during the cleaning process, leading to contamination and inefficiencies in cleaning.
Innovation Solution
A substrate cleaning device with a processing tank, movable spray tubes, and a scanning mechanism that emits cleaning liquids along the outer periphery of wafers to efficiently remove foreign matter, utilizing multiple nozzles and arms to ensure thorough cleaning while minimizing unnecessary chemical usage and power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a wafer is raised from a processing tank that stores cleaning liquid, then the wafer can be removed from the cleaning environment, but foreign matter is transferred from the outer periphery of the wafer to the surface of the wafer via the cleaning liquid
Solution Approach 1:
The patent applies preliminary action by performing cleaning of the outer periphery of the wafer before the wafer is raised from the processing tank. The spray tube moves to the outer periphery position and sprays cleaning liquid to remove foreign matter in advance, preventing contamination during the lifting process. This resolves the contradiction by eliminating harmful foreign matter transfer before it can occur during wafer removal.
2Reliability
If spray tubes are used to clean wafers, then cleaning effectiveness is improved, but device complexity increases due to multiple spray tubes and scanning mechanisms
Solution Approach 1:
The patent applies universality by designing a single spray tube that can perform multiple cleaning functions through movement. The spray tube can clean both the outer periphery and surface of wafers by moving to different positions, eliminating the need for multiple separate spray tubes. This reduces device complexity while maintaining comprehensive cleaning effectiveness.
Solution Approach 2:
The patent applies dynamics by using a movable spray tube that can change its position dynamically. The spray tube moves along the wafer surface and can be positioned at the outer periphery or on the surface, allowing one spray tube to perform multiple cleaning operations. This dynamic positioning simplifies the overall device structure compared to having fixed multiple spray tubes.
3Reliability
If cleaning liquid is emitted to clean wafers, then foreign matter is removed, but chemical usage and power consumption increase
Solution Approach 1:
The patent applies local quality by directing cleaning liquid precisely to specific locations where foreign matter is present. The spray tube moves to the outer periphery position to clean that specific area, and can be positioned to clean the surface when needed. This localized cleaning approach reduces overall chemical usage compared to flooding the entire wafer surface, while maintaining effective foreign matter removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively prevents foreign matter adherence to wafer surfaces, reduces cleaning time, and optimizes resource usage by employing multiple movable spray tubes and intelligent nozzle control, ensuring thorough and efficient cleaning.
Implementation Method 1
The spray tube extends in the thickness direction and is configured to emit a cleaning liquid to each substrate accommodated in the processing tank
Data Source
AI summary
According to an embodiment, a substrate cleaning device includes a processing tank, at least one spray tube, and a scanning mechanism. The processing tank can accommodate a plurality of substrates arranged in a thickness direction of the substrates. The spray tube extends in the thickness direction and is configured to emit a cleaning liquid to each substrate accommodated in the processing tank. The scanning mechanism is configured to move the spray tube along an outer periphery of the substrate to perform a scan.