Wafer Edge Support Material for Ultra-Thin Thinning

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Solution Overview

Problem

Existing wafer thinning technologies fail to effectively reinforce wafer strength, particularly at the edge, leading to cracking and chipping during grinding and handling due to lack of support and uneven force distribution.

Innovation Solution

A wafer strength reinforcement system involving a tape and a wafer edge support material, such as a liquid or semi-viscous paste, applied between the tape and the wafer edge to provide structural integrity and cushioning during thinning processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If the wafer is ground ultra thin to reduce size and weight, then the wafer thickness is reduced, but the edge becomes extremely sharp and weak, leading to cracking and chipping

Engineering Contradiction:

Improvewafer thicknessVSAvoidedge strength

Core Design Contradiction:

Length of moving objectVSStrength

Solution Approach 1:

The patent applies a support material to the wafer edge before the thinning process begins. This preliminary reinforcement prevents the edge from becoming vulnerable during subsequent grinding operations, allowing ultra-thin thickness to be achieved without edge failure.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The support material is applied specifically to the edge region of the wafer rather than the entire wafer surface. This localized reinforcement targets the specific area that becomes vulnerable during thinning, providing edge strength while maintaining overall wafer thinness.

Inventive Principle:

Principle #3Local quality

2Stress or pressure

If existing wafer thinning technologies are used to reduce wafer stress, then wafer stress is reduced within the wafer body, but the edge still lacks support and remains susceptible to cracking under uneven force

Engineering Contradiction:

Improvewafer stressVSAvoidedge reliability

Core Design Contradiction:

Stress or pressureVSReliability

Solution Approach 1:

The support material acts as an intermediary element between the wafer edge and external forces. It absorbs and distributes uneven forces during handling and processing, protecting the fragile ultra-thin edge from cracking while allowing the wafer body to maintain reduced stress levels.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS8124455B2Wafer strength reinforcement system for ultra thin wafer thinning

Publication Date: 2012.02.28 STATS CHIPPAC LTD

AI summary

A wafer strength reinforcement system is provided including providing a wafer, providing a tape for supporting the wafer, and positioning a wafer edge support material for location between the tape and the wafer.