Wafer Edge Holding Structure for Vibration-Damped High-Speed Support
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing holding devices for semiconductor disks face challenges in maintaining stable positioning at high speeds, preventing damage and contamination, and ensuring long service life, while also allowing access to the edge area for inspection.
Innovation Solution
A holding device comprising a metal alloy base element and plastic composition support elements, with a positive azimuth and radial fit, featuring projections for edge support and a sloping surface to reduce vibrations and contact area, ensuring stable support and reduced risk of damage or contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If grippers are used to hold the wafer, then stable fixation at high speeds is achieved, but the wafer surface may be damaged or contaminated
Solution Approach 1:
The patent uses a flexible membrane made of elastomer material that conformally covers the wafer surface. This membrane acts as a protective layer that prevents direct contact between the wafer and the rigid holder structure, thereby avoiding surface damage and contamination while maintaining stable fixation through suction forces applied to the membrane itself
Solution Approach 2:
The elastomer membrane serves as an intermediary between the holder and the wafer. Instead of the holder directly gripping the wafer, the membrane mediates the contact, allowing force transmission while protecting the wafer surface from mechanical damage and metal contamination
2Reliability
If a rigid holder structure is used, then stable support at high speeds is achieved, but vibrations and deformation increase
Solution Approach 1:
The patent changes the physical parameters of the holder structure by using an elastomer material with specific viscoelastic properties. This material provides both the rigidity needed for stable support at high speeds and the damping characteristics that reduce vibrations and deformation, optimizing the balance between stability and vibration control
3Reliability
If the wafer is fully covered by the holder, then stable holding is achieved, but the edge area becomes inaccessible for inspection
Solution Approach 1:
The flexible membrane holder is designed to conformally cover only the necessary central area of the wafer while leaving the edge region exposed. This allows stable holding of the wafer body during rotation while maintaining accessibility of the edge area for optical inspection and measurement processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device provides stable support at high speeds, significantly reduces vibrations, and extends service life by using wear-resistant metal alloys and vibration-damping plastic compositions, while minimizing contact and contamination risks, facilitating effective surface inspection.
Implementation Method 1
The plastic film also acts as a vibration dampener
Implementation Method 2
the surface on the upper side of the projections (21) slopes downwards in the radially inward direction
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Holding device for a horizontally arranged disk (30) made of semiconductor material, comprising at least one base element (10) and several support elements (20) for supporting the disk (30) made of semiconductor material, wherein the at least one base element (10) is made of a metal alloy and the several support elements (20) are made of a plastic composition, the several support elements (20) are arranged concentrically, the several support elements (20) are detachably attached to the at least one base element (10) in an azimuthal form-fit and in a radially outward form-fit, the several support elements (20) have projections (21) on the radially inward side for supporting the edge of the disk (30) made of semiconductor material, and the surface on the upper side of the projections (21) slopes downwards in a radially inward direction.