Wafer Edge Cleaning with Multi-Angle High-Pressure Water Jets
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Solution Overview
Problem
Conventional wafer cleaning methods require a consumable cleaning tool, such as a sponge, which incurs replacement costs and is inefficient for removing resin from the circumferential edge of wafers.
Innovation Solution
A wafer cleaning apparatus that uses a holding table with a motor to rotate the wafer and a cleaning unit with three nozzles to jet high-pressure water from different directions, eliminating the need for a cleaning tool by effectively removing resin from the wafer's edge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cleaning tool such as a sponge is used to remove resin from the circumferential edge of the wafer, then the resin can be removed, but the cleaning tool requires replacement which incurs cost and operational overhead
Solution Approach 1:
The patent replaces the mechanical cleaning tool (sponge) with a fluid-based cleaning system using high-pressure water jets. The cleaning unit directs water from multiple directions to remove resin from the wafer edge, eliminating the need for consumable mechanical tools and their associated replacement costs.
Solution Approach 2:
The invention utilizes hydraulic principles by employing high-pressure water jets to clean the wafer circumferential edge. The cleaning unit delivers water at sufficient pressure to effectively remove adhering resin without requiring physical contact with consumable tools.
2Manufacturing precision
If high-pressure water is jetted from multiple directions to thoroughly clean the wafer edge, then cleaning completeness is improved, but the device complexity increases
Solution Approach 1:
The cleaning system is segmented into multiple nozzles positioned at different locations and angles around the wafer circumferential edge. This segmentation allows each nozzle to target specific areas, ensuring comprehensive coverage of the entire edge surface through coordinated multi-directional cleaning.
Solution Approach 2:
The cleaning approach transitions from a single-direction or surface-level cleaning method to a multi-dimensional attack on the contaminant. Nozzles are positioned to jet water from different spatial directions (including angled and vertical approaches), effectively cleaning all surfaces of the circumferential edge including top, bottom, and side surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus efficiently cleans the wafer's edge without a consumable tool, reducing replacement costs and ensuring thorough removal of contaminants like resin, while also incorporating a drying phase to expedite the process.
Implementation Method 1
a cleaning unit that jets high-pressure water toward the circumferential edge of the wafer from an outer side than the circumferential edge of the wafer held by the holding surface, to clean the circumferential edge of the wafer
Implementation Method 2
the cleaning unit is configured to jet the high-pressure water utilizing pressure of air by mixing water and the air
Data Source
AI summary
A wafer cleaning apparatus for cleaning a circumferential edge of a wafer includes a cleaning unit that jets water toward the circumferential edge of the wafer from an outer side of the circumferential edge of the wafer held by a holding surface of a holding table, to clean the circumferential edge of the wafer. The cleaning unit includes a first nozzle that jets the water to the circumferential edge of the wafer from an outer side of the circumferential edge of the wafer in a direction parallel to the holding surface, a second nozzle that jets the water to the circumferential edge of the wafer in a direction of 45 degrees downward relative to the holding surface, and a third nozzle that jets the water to the circumferential edge of the wafer in a direction of 45 degrees upward relative to the holding surface.