Wafer End Effector Clamp for Thin-Wafer Flatness Control
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Solution Overview
Problem
Current end effectors used in semiconductor wafer handling often damage or contaminate thin wafers due to mechanical forces and fail to accommodate varying wafer sizes and process steps effectively, especially in maintaining wafer flatness and preventing warpage.
Innovation Solution
An end effector system with a wafer support, bearing arm, and low-friction moving clamp that includes support pads and a retractable mechanism to securely grip wafers of different sizes, minimizing mechanical interaction and using a low-friction vacuum cylinder and angular strike face to apply force without damaging the wafers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mechanical forces are applied to grip the wafer, then the wafer can be held and transferred, but the wafer may be damaged or contaminated
Solution Approach 1:
The patent replaces traditional mechanical gripping systems with a magnetic field-based end effector. The magnetic field exerts force on the ferromagnetic wafer holder without direct mechanical contact, eliminating damage and contamination risks associated with mechanical forces while maintaining reliable gripping and transfer capabilities.
Solution Approach 2:
The patent introduces a ferromagnetic wafer holder as an intermediary between the magnetic field and the wafer. The holder is attracted to the magnetic field, providing secure gripping, while the wafer itself remains free from direct mechanical contact, thus preventing damage and contamination.
2Adaptability or versatility
If a fixed end effector design is used, then the structure is simple, but it cannot accommodate varying wafer sizes and process steps
Solution Approach 1:
The patent employs a flexible magnetic field generation system that can dynamically adjust its configuration. The magnetic field end effector can be repositioned and reconfigured to accommodate different wafer sizes and process requirements, providing adaptability without requiring multiple fixed mechanical structures.
Solution Approach 2:
The magnetic field end effector is designed to perform multiple functions across different process steps and wafer sizes. A single magnetic field system can grip, transfer, and position various wafer types by adjusting field configuration, eliminating the need for multiple specialized mechanical end effectors.
3Ease of operation
If strong mechanical forces are used to handle thin wafers, then the wafers can be securely gripped, but the wafers may experience warpage or loss of flatness
Solution Approach 1:
The patent replaces mechanical gripping forces with magnetic field forces. The magnetic field provides sufficient gripping strength to hold thin wafers securely through the ferromagnetic holder, while the distributed nature of the magnetic force and the absence of concentrated mechanical pressure points prevents warpage and maintains wafer flatness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively handles and transfers thin semiconductor wafers of multiple sizes without damaging or contaminating them, maintaining wafer flatness and reducing warpage, enabling efficient processing across various steps.
Implementation Method 1
low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm
Implementation Method 2
backside suction provided by, for example, vacuum draw eyelets on the end effector
Data Source
AI summary
The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.