Wafer Electrode Region Segmentation for Probe Pressure Control
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Solution Overview
Problem
Deterioration in communication reliability between a wafer and a probe card due to uneven pressure distribution and abrasion of electrodes during electrical connection.
Innovation Solution
The electrodes on the wafer are rearranged into distinct regions with different pressure thresholds, allowing for separate control of pressure application, using a pressure sensor to ensure appropriate pressure is applied to each region, thereby reducing abrasion and maintaining reliable communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If uniform pressure is applied to all electrodes during electrical connection, then the connection process is simple, but communication reliability deteriorates due to uneven pressure distribution and electrode abrasion
Solution Approach 1:
The electrode array is divided into multiple regions (first region and second region) with different pressure thresholds. The first region contains electrodes with a first pressure threshold, while the second region contains electrodes with a second pressure threshold. This segmentation allows differential pressure control to be applied to different electrode groups, optimizing both connection reliability and reducing abrasion on sensitive electrodes.
Solution Approach 2:
Different pressure thresholds are assigned to different regions of the electrode array. The first region has a first pressure threshold suitable for its electrodes, while the second region has a second pressure threshold optimized for its electrodes. This local quality approach ensures that each electrode receives appropriate pressure tailored to its specific requirements, improving communication reliability while minimizing unnecessary abrasion.
2Reliability
If higher pressure is applied to ensure electrical connection, then connection reliability improves, but electrode abrasion increases causing communication deterioration
Solution Approach 1:
The pressure threshold is made dynamic and region-dependent rather than uniform across all electrodes. Each region has its own pressure threshold that can be independently controlled. This dynamic approach allows the system to apply higher pressure only where necessary to ensure connection reliability, while applying lower pressure in regions where electrodes are more susceptible to abrasion, thus resolving the contradiction between connection reliability and electrode protection.
Data Source
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AI summary
According to one embodiment, a wafer (10) includes a substrate (11) including a first region (RA) and a second region (RB) that do not overlap each other; a first chip unit and a second chip unit (100) each arranged on the substrate; a first electrode (16A) and a second electrode (16B) each electrically connected to the first chip unit; and a third electrode (16A) and a fourth electrode (16B) each electrically connected to the second chip unit. The first electrode and the third electrode are arranged in the first region. The second electrode and the fourth electrode are arranged in the second region. The first region is independent of a region in which the first chip unit and the second chip unit are provided.