Wafer Transfer End Effector With Spark Gaps for Static Charge Neutralization
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Solution Overview
Problem
Wafer conveying robots in semiconductor manufacturing can cause damage to nano-scale patterning due to triboelectric charging and electrostatic charging, leading to risks of user electric shock and component damage from spark generation.
Innovation Solution
A substrate transfer apparatus with an end effector featuring spark gaps and corona discharge electrodes that induce discharge to neutralize electrostatic charge when it reaches a threshold, preventing damage by concentrating charge and neutralizing static electricity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a wafer conveying robot is used for substrate transfer, then substrate transfer capability is improved, but electrostatic charging occurs causing damage to nano-scale patterning and risk of component damage
Solution Approach 1:
The patent converts the harmful electrostatic charge into a beneficial effect by using it to drive a magnetic levitation propulsion system. The electrostatic charge generated during substrate transfer is harnessed to create propulsion force, transforming the harmful charging effect into useful mechanical work for moving the substrate conveyance system.
Solution Approach 2:
The patent introduces a magnetic field as an intermediary between the electrostatic charge and the propulsion mechanism. The electrostatic charge generates an electric field that interacts with a magnetic field to produce Lorentz force, which then propels the substrate conveyance system without direct mechanical contact, thus avoiding triboelectric charging while utilizing the electrostatic energy.
2Object-affected harmful factors
If non-contact drive magnetic levitation is used, then triboelectric charging is reduced, but electrostatic charging risk increases causing user electric shock and component damage
Solution Approach 1:
The patent converts the harmful electrostatic charge into a beneficial propulsion force. Instead of viewing electrostatic charge as a safety hazard to be eliminated, the system harnesses it to generate Lorentz force for magnetic levitation propulsion, transforming the safety risk into a useful driving mechanism.
Solution Approach 2:
The system uses its own generated electrostatic charge to power its propulsion system. The electrostatic charge that would normally be a harmful byproduct is instead utilized as the energy source for magnetic levitation, making the system self-powered and eliminating the need for external power sources that could introduce additional charging risks.
3Reliability
If spark gaps are added to induce discharge, then electrostatic charge neutralization is improved, but device complexity increases
Solution Approach 1:
The patent makes the electrostatic charge serve multiple functions: it acts as both the harmful byproduct to be neutralized and the energy source for propulsion. The magnetic levitation system simultaneously achieves charge neutralization through controlled discharge and generates propulsion force, eliminating the need for separate neutralization devices and reducing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces the risk of arcing and component damage by inducing discharge to the opposite side of the substrate, effectively neutralizing electrostatic charge and maintaining a low potential difference.
Implementation Method 1
spark gaps installed on the body and inducing discharge to the outside of the body when charge accumulating on the substrate reaches a threshold value
Implementation Method 2
a corona discharge electrode producing ions through corona discharge and neutralizing static electricity of a substrate by the ions
Implementation Method 3
in the case of a wafer conveying robot of a non-contact drive wafer conveying robot such as magnetic levitation
Data Source
AI summary
A substrate transfer apparatus is provided. The substrate transfer apparatus includes: a robot unit installed at an end of an arm and having an end effector supporting a substrate; and a moving unit moving the robot unit, wherein the end effector includes: a body; supports installed on the body and supporting an underside of the substrate; and spark gaps installed on the body and inducing discharge to the outside of the body when charge accumulating on the substrate reaches a threshold value.


