Semiconductor Wafer Control via End-of-Line Feedback
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Solution Overview
Problem
Current semiconductor manufacturing processes lack a substantial focus on end-of-line parameters, leading to yields and performance of devices not meeting targeted expectations, as they are primarily driven by inline parameters without considering critical end-of-line characteristics like yield, reliability, and performance.
Innovation Solution
A method and system that model and correlate inline parameters with target end-of-line parameters, using a process controller to adjust inline parameters during processing to achieve desired end-of-line results, incorporating a weighted objective function to prioritize specific end-of-line parameters such as performance over yield, and utilizing feedback and feed-forward compensation to align processing with targeted characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manufacturing processes are driven primarily by inline parameters, then processing efficiency is maintained, but end-of-line parameters such as yield, reliability, and performance do not meet targeted expectations
Solution Approach 1:
The patent implements a feedback control system where end-of-line parameter measurements are fed back to adjust inline process parameters. The system measures actual end-of-line parameters, compares them to target values, and uses this information to modify subsequent processing steps, creating a closed-loop control system that continuously improves product quality while maintaining productivity
Solution Approach 2:
The system performs preliminary actions by predicting end-of-line parameters based on inline measurements and proactively adjusting process parameters before defects occur. The feedback control system anticipates potential quality issues and makes preventive adjustments to process parameters, ensuring end-of-line specifications are met without sacrificing production efficiency
2Reliability
If multiple end-of-line parameters are optimized simultaneously, then overall product quality improves, but process control complexity increases
Solution Approach 1:
The patent segments the control of multiple end-of-line parameters by identifying and controlling key inline parameters that have the most significant impact on quality. Rather than attempting to control all possible parameters simultaneously, the system focuses on critical process parameters that drive multiple quality outcomes, simplifying the control architecture while maintaining comprehensive quality optimization
Solution Approach 2:
The system optimizes multiple end-of-line parameters by making coordinated changes to a smaller set of critical process parameters. The feedback control system adjusts process parameters based on their predicted impact on multiple quality attributes, using parameter interrelationships to achieve simultaneous optimization of yield, reliability, and performance without requiring separate control mechanisms for each quality metric
Data Source
AI summary
A method and an apparatus for processing semiconductor wafer based upon end-of-line (EOL) parameters. A target end-of-line parameter relating to a semiconductor wafer is determined. An inline parameter relating to processing of the semiconductor wafer is controlled in response to the target end-of-line parameter using a controller. Controlling the inline parameter includes adjusting a target inline parameter that correlates to the inline parameter.