Semiconductor Wafer Etching Protection Ring
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Solution Overview
Problem
In semiconductor manufacturing, it is challenging to selectively remove a portion of one wafer without inadvertently etching the adjacent wafer, especially when bonding silicon wafers together.
Innovation Solution
A semiconductor manufacturing apparatus is designed with a protection ring and a fluid supply system that mounts an annular member around the first wafer to prevent etching, using a vacuum chuck to hold the wafers and a multiple nozzle array to apply etching liquid to the second wafer while protecting the first wafer with a protective liquid and gas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If etching liquid is applied to remove a portion of one wafer, then the desired substrate portion is removed, but the adjacent wafer is also inadvertently etched
Solution Approach 1:
The patent divides the processing area into distinct zones by introducing a protection ring that physically segments the space between the first and second wafers. This segmentation allows the etching liquid to selectively access only the second wafer while being blocked from the first wafer, thereby achieving precise control over which substrate portions are etched.
Solution Approach 2:
The protection ring acts as an intermediary element positioned between the two wafers. It mediates the interaction between the etching liquid and the wafers by allowing the liquid to reach the second wafer while preventing contact with the first wafer, thus enabling selective etching without damaging the adjacent wafer.
2Manufacturing precision
If a protection ring is mounted around the first wafer, then etching selectivity is improved, but device complexity increases
Solution Approach 1:
The protection ring serves multiple functions simultaneously: it acts as a physical barrier to prevent etching liquid from reaching the first wafer, provides structural support for mounting the annular member, and defines the processing boundary. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity.
Solution Approach 2:
The protection ring is implemented as a thin annular member that can be easily mounted and removed. This flexible, thin-film approach minimizes the added complexity compared to more rigid or complex protective structures, while still effectively preventing etching liquid from reaching the first wafer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for precise etching of the second wafer while minimizing etching of the first wafer, ensuring appropriate removal of the desired substrate portion without damaging the surrounding wafer.
Implementation Method 1
a vacuum chuck to hold the wafers
Data Source
AI summary
A semiconductor manufacturing apparatus includes a mounting unit arranged to mount an annular member, having an annular shape, to a work substrate including a first substrate and a second substrate bonded to each other so that the annular member surrounds the first substrate. The apparatus further includes a holding unit arranged to hold the work substrate having the annular member mounted thereto. The apparatus further includes a first fluid supply unit arranged to supply a first fluid to the second substrate of the work substrate held by the holding unit.