Wafer Fault Reference Map Denoising for Accurate Classification

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Solution Overview

Problem

The reliability of semiconductor wafer fault analysis is compromised due to insufficient reference maps and noise contamination, making it difficult to accurately classify fault types in semiconductor devices.

Innovation Solution

A semiconductor wafer fault analysis system that employs a database with pre-processed reference maps generated using auto-encoders/decoders specific to each fault type, removing noise and augmenting information to improve accuracy and reliability, and a fault type analyzer that classifies target maps based on these pre-processed maps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If reference maps are used for fault type classification, then fault classification can be performed, but the reliability is low due to noise and insufficient reference maps

Engineering Contradiction:
Improvefault classification reliabilityVSAvoidfault type classification accuracy
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The patent applies preliminary action by pre-processing reference maps before they are used for fault classification. Auto-encoders are trained in advance to learn noise patterns specific to each fault type, and these pre-trained models are then used to remove noise from reference maps. This preliminary noise removal and map generation actions improve the quality of reference data before actual fault classification occurs.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements local quality by creating fault-type-specific auto-encoders that are tailored to the characteristics of each particular fault type. Instead of using a single generic noise removal model, separate auto-encoders are trained for different fault types (e.g., scratch, particle, dishing), allowing each model to learn and remove noise patterns specific to its designated fault type, thereby improving local classification accuracy.

Inventive Principle:
Principle #3Local quality

2Measurement precision

If more reference maps are collected to improve classification accuracy, then fault type classification becomes more reliable, but the complexity of the database and processing increases

Engineering Contradiction:
Improvefault type classification accuracyVSAvoiddatabase complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent applies copying by generating synthetic reference maps through the auto-encoder framework. Instead of collecting and storing numerous real reference maps for each fault type, the system learns the underlying patterns from limited real data and generates additional synthetic reference maps that replicate these patterns. This copying approach expands the effective size of the reference database without proportionally increasing the complexity of data collection and management.

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The patent utilizes parameter changes by transforming the reference maps through the auto-encoder process. The auto-encoders learn optimal parameter transformations that remove noise while preserving fault characteristics. By changing the parameters (noise levels, map characteristics) through the learned transformation, the system generates enhanced reference maps that improve classification accuracy without requiring proportional increases in database complexity.

Inventive Principle:
Principle #35Parameter changes

3Measurement precision

If noise is removed from reference maps to improve classification accuracy, then fault type classification becomes more reliable, but the processing time and computational resources increase

Engineering Contradiction:
Improvefault type classification accuracyVSAvoidprocessing time
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The patent applies preliminary action by pre-training the auto-encoders offline before actual fault classification operations. The noise removal process is performed in advance during the model training phase, and once trained, the auto-encoders can rapidly apply the learned noise removal patterns to new reference maps during operational use. This preliminary training action separates the computationally intensive learning phase from the faster application phase.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements self-service by using the auto-encoder framework to automatically learn and apply noise removal patterns without requiring manual intervention for each noise removal operation. The system trains the models to self-adapt to different fault types and noise patterns, and once trained, the models autonomously perform noise removal on reference maps, reducing the need for continuous human oversight and manual processing.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS11741596B2Semiconductor wafer fault analysis system and operation method thereof
Publication Date: 2023.08.29 SAMSUNG ELECTRONICS CO LTD
  • US11741596B2 patent drawing
  • US11741596B2 patent drawing
  • US11741596B2 patent drawing

AI summary

A semiconductor wafer fault analysis system includes: a database to store a first reference map, which is classified as a first fault type, and a second reference map, which is classified as a second fault type; a first auto-encoder/decoder to remove a noise corresponding to the first fault type from the first reference map to generate a first pre-processed reference map; a second auto-encoder/decoder to remove a noise corresponding to the second fault type from the second reference map to generate a second pre-processed reference map; and a fault type analyzer. The database is updated based on the first and second pre-processed reference maps, and the fault type analyzer is to classify a fault type of a target map based on the updated database. The target map is generated by measuring a target wafer.